LED Package Strip Manufacturing via Squeeze-Printed Phosphor
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Solution Overview
Problem
Conventional light-emitting device package manufacturing methods are time-consuming and costly, leading to increased product prices, reduced productivity, and performance differences among manufactured packages, while also causing substrate strip deformation.
Innovation Solution
A method involving mounting light-emitting devices on a substrate strip, forming a phosphor, creating a reflective member to surround the phosphor, and singulating unit packages by cutting the substrate and reflective member, which includes squeeze-printing the phosphor and using a molding material in cavities formed by a plate mold, and optionally using a supporting member with UV adhesive for temporary fixation and separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If light-emitting devices are separately mounted on substrates and optical members are separately formed on each device, then each device can be individually optimized, but the packaging process becomes time-consuming and costly, reducing productivity
Solution Approach 1:
The patent combines multiple light-emitting devices onto a single substrate to form a light-emitting device package. Optical members are formed on the entire package rather than individually on each device. This merging approach maintains individual device functionality while enabling batch processing, thereby improving productivity without sacrificing device optimization
Solution Approach 2:
A single substrate serves multiple functions: it mounts multiple light-emitting devices, provides structural support, and acts as a platform for forming optical members that serve all devices simultaneously. This multi-functionality reduces the number of separate components and processes needed, enhancing manufacturing efficiency
2Reliability
If separate packaging processes are used for each light-emitting device, then individual device characteristics can be maintained, but product cost increases and productivity decreases
Solution Approach 1:
Multiple light-emitting devices are packaged together on a single substrate with shared optical members, reducing the number of separate packaging operations. This approach maintains individual device characteristics through proper mounting while significantly reducing manufacturing cost and complexity through batch processing
Solution Approach 2:
The package structure is segmented into distinct functional zones: mounting regions for individual light-emitting devices and common regions for optical members. This segmentation allows individual device optimization while enabling efficient batch manufacturing of the complete package
3Reliability
If conventional packaging methods are used, then devices can be properly protected, but the packages become relatively large and thick, preventing manufacturing of small and thin products
Solution Approach 1:
The patent transitions from vertical stacking or lateral arrangement of separate packages to a planar integration approach where multiple devices are mounted on a single substrate in the same plane. This dimensional reorganization reduces overall package thickness while maintaining protective functionality through the substrate structure
4Manufacturing precision
If optical members are separately provided on light-emitting devices, then each device can be optimized, but performance differences occur among manufactured packages
Solution Approach 1:
Optical members are formed on the entire package substrate rather than individually on each light-emitting device. This ensures uniform optical characteristics across all devices in the package while maintaining proper optical coupling to each device, thereby improving performance consistency
Solution Approach 2:
The optical members are designed with local variations in thickness or composition at specific regions corresponding to individual light-emitting devices, while maintaining overall uniformity across the package. This allows device-specific optimization through localized adjustments while preserving consistent performance across the entire package
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the process, reduces product costs and performance variations, enables the production of small and thin packages, and prevents substrate deformation, thereby improving productivity and color uniformity.
Implementation Method 1
the phosphor may be squeeze-printed on the substrate strip and the light-emitting devices using a mask
Implementation Method 2
a UV light projection step for projecting UV light onto the UV adhesive through the light-transmitting glass to eliminate an adhesive force of the UV adhesive
Data Source
AI summary
Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.