LED Package Structure with Embedded Chips and Lenses
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Solution Overview
Problem
Conventional LED package assemblies for creating white or colorful light sources are time-consuming and costly to produce, and certain LEDs, like blue Gallium Nitride or bluish Indium Gallium-nitride LEDs, are prone to deterioration from static electricity due to their p-n junction being close to the surface.
Innovation Solution
An LED package structure featuring at least three lenses with embedded LED chips, each with conductive leads extending from the lens surfaces, arranged to refract light and positioned in an array with a geometrical center, using transparent materials like glass, plastic, or resin, to create a compact and durable colorful light source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If at least three colored LEDs are packaged spatially close to each other in a single unit, then a full colored LED display or white light source can be achieved, but the production process becomes time-consuming and costly
Solution Approach 1:
The patent divides the LED package into separate individual packages, each containing a single colored LED chip with its own lens. Instead of packaging multiple LED chips together in one unit, each LED is packaged separately, which simplifies the packaging process for each individual unit and allows for more efficient production while still enabling colorful displays through arraying multiple packages
Solution Approach 2:
The patent transitions from spatial packaging (multiple LEDs in one package) to dimensional arrangement (multiple packages arranged in arrays). By using lens arrays with specific geometric arrangements, the patent achieves full-color display capabilities through the spatial arrangement of multiple single-LED packages rather than packaging multiple LEDs together
2Adaptability or versatility
If at least three colored LEDs are packaged spatially close to each other in a single unit, then a full colored LED display or white light source can be achieved, but the identification and sorting process becomes very time-consuming and costly
Solution Approach 1:
Each LED package is segmented as an independent unit with a single colored LED chip, making identification and sorting simpler and more automated. Instead of identifying and sorting multiple different colored LEDs within one package, each package contains only one color, reducing the complexity of the identification and sorting processes
Solution Approach 2:
The patent uses the lens color or coating to indicate the LED chip color within each package. By making the lens color-matched to the LED chip color or using specific color coding, the identification process becomes visually straightforward and can be easily automated, eliminating the need for complex identification and sorting procedures
3Volume of moving object
If blue Gallium Nitride or bluish Indium Gallium-nitride LEDs are used, then a compact and efficient LED can be achieved, but the LED becomes prone to deterioration from static electricity
Solution Approach 1:
The patent incorporates static electricity protection measures during the packaging process itself. By designing the package structure and assembly process to prevent static electricity accumulation and discharge before it can damage the LED chip, the patent protects the vulnerable blue LEDs without requiring changes to the LED chip design or increasing its size
Solution Approach 2:
The patent uses the lens and package structure as an intermediary barrier between the external environment and the LED chip. By controlling the package environment and using appropriate materials for the lens and encapsulation, the patent reduces the LED's exposure to static electricity while maintaining the compact form factor
4Ease of operation
If conductive leads of the LEDs are touched in the LED packages assembly, then electrical connection can be established, but small currents can destroy the susceptible LEDs
Solution Approach 1:
The patent incorporates static electricity protection measures during the packaging process itself. By designing the package structure and assembly process to prevent static electricity accumulation and discharge before it can damage the LED chip, the patent protects the vulnerable blue LEDs without requiring changes to the LED chip design or increasing its size
Solution Approach 2:
The patent uses the lens and package structure as an intermediary barrier between the external environment and the LED chip. By controlling the package environment and using appropriate materials for the lens and encapsulation, the patent reduces the LED's exposure to static electricity while maintaining the compact form factor
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient and cost-effective production of colorful LED displays with reduced risk of static electricity damage, providing a uniform light mixing and improved durability of the LEDs.
Implementation Method 1
The first surface and the second surface of each lens are capable of refracting light emitted from a corresponding embedded LED chip
Data Source
AI summary
A light emitting diode (LED) package structure. In one embodiment, the LED package structure includes at least three lenses, each lens having a body portion with at least a first surface, a second surface, a third surface and a fourth surface, and at least three LED chips, each LED chip being capable of emitting light in a unique color and having a first conductive lead and a second conductive lead and embedded in the body portion of a corresponding lens such that the first conductive lead and the second conductive lead extend out of the body portion from one of the third surface and the fourth surface of the corresponding lens. The at least three lenses and the at least three LED chips are assembled such that the first surface of a lens is in contact with the second surface of one of the rest of the at least three lenses and the at least three LED chips are positioned substantially proximate to each other.