LED Package with Thermally-Conductive Substrate

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Solution Overview

Problem

The miniaturization of LED-based modules is limited by the size of the printed circuit board required for heat dissipation and the structural constraints of existing heat sinks, which restricts design freedom and increases the module's thickness.

Innovation Solution

A light emitting device package is designed with a thermally-conductive substrate having mounting and bending regions, where the light emitting device and driving device modules are mounted on opposite surfaces, utilizing a flexible printed circuit board and an autoclave method to reduce adhesive layer thickness and enhance bonding reliability, with the thermally-conductive substrate acting as a heat sink.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a conventional printed circuit board structure is used for mounting LED and driving devices, then the devices can be mounted and driven, but the module size increases and miniaturization is limited due to heat dissipation requirements and structural constraints

Engineering Contradiction:

Improvemodule sizeVSAvoidheat dissipation capability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent combines the printed circuit board and heat sink into a single integrated thermally-conductive substrate. The driving device is mounted on one surface while LED chips are mounted on the other surface, eliminating the need for separate heat dissipation structures and reducing overall module volume while maintaining effective heat management.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes the thickness dimension by mounting components on opposite surfaces of the thermally-conductive substrate. This vertical arrangement allows the driving device and LED chips to be positioned at different heights, enabling compact integration without increasing the planar footprint of the module.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If a thick adhesive layer is used to bond the flexible printed circuit board, then bonding reliability improves, but the module thickness increases

Engineering Contradiction:

Improvebonding reliabilityVSAvoidmodule thickness

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The patent applies autoclave processing to change the physical state and bonding characteristics of the adhesive layer. The autoclave provides controlled heat and pressure that enhances adhesive curing and bonding strength, allowing the use of a thin adhesive layer (5-20 μm) to achieve reliable bonding without increasing module thickness.

Inventive Principle:

Principle #35Parameter changes

3Stability of the object's composition

If the thermally-conductive substrate is made rigid for stable mounting, then mounting stability improves, but design freedom and spatial flexibility are reduced

Engineering Contradiction:

Improvemounting stabilityVSAvoiddesign freedom

Core Design Contradiction:

Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The patent employs a flexible printed circuit board as the thermally-conductive substrate, which can be bent and conform to various mounting surfaces. The substrate includes designated bending regions that allow flexibility while maintaining structural integrity in mounting regions, providing both adaptability for different applications and stability for reliable component mounting.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves spatial freedom, reduces module thickness, and enhances heat dissipation characteristics, allowing for more compact and reliable LED-based modules while maintaining effective heat management.

Implementation Method 1

an integrated module in which a module in which a light emitting device and a driving device are mounted on an upper portion and a lower portion of a thermally-conductive substrate is pressed by an autoclave

Methodology Applied

Scientific EffectHeat: Heating

Implementation Method 2

Methodology Applied

Scientific EffectPressure: Pressure Increase

Implementation Method 3

a thermally-conductive substrate having at least two mounting regions on which chips are mounted and at least one bending region

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentEP3306182B1Light-emitting device package and vehicular light comprising same

Publication Date: 2020.08.05 LG INNOTEK CO LTD

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AI summary

According to an embodiment, a light emitting device package includes: a thermally-conductive substrate having at least two mounting regions on which chips are mounted and at least one bending region; a light emitting device module including a light emitting device arranged on one surface of the mounting region; and a driving device module including a driving unit arranged on the other surface opposite to the one surface of the mounting region.