LED Package Substrate Terminals Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
UV light emitting diode packages face reduced lifespan due to heat generation, necessitating efficient heat dissipation solutions, particularly in chip-on-board type packages that require connectors for external power sources.
Innovation Solution
A chip-on-board type light emitting diode package design featuring a substrate with integrated first and second pads for mounting diode chips, a reflector with an opening to expose the chips, and terminals connected to an external power source, allowing for efficient heat dissipation and easy connector integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If UV light emitting diode chips are mounted on a substrate, then light emission function is achieved, but heat generation reduces lifespan
Solution Approach 1:
The patent extracts the heat dissipation function from the substrate by introducing a dedicated heat dissipation member with high thermal conductivity material. This separate component is positioned between the UV LED chip and substrate to specifically address heat removal, allowing the substrate to maintain its electrical and mechanical functions while the heat dissipation member handles thermal management.
Solution Approach 2:
The patent employs composite material structure by combining the substrate (providing electrical connection and mechanical support) with a heat dissipation member made of high thermal conductivity material (such as metal or metal alloy). This composite approach allows simultaneous achievement of electrical functionality and effective thermal management, resolving the contradiction between maintaining LED operation and managing heat generation.
2Illumination intensity
If a reflector is added to surround the LED chips, then light output is improved, but device complexity increases
Solution Approach 1:
The patent merges the reflector with the substrate by forming the reflector as an integrated part of the substrate structure. The substrate includes a reflective surface that reflects light from the LED chips in a predetermined direction, eliminating the need for a separate reflector component. This integration maintains effective light output while reducing device complexity and the number of assembly steps.
3Ease of operation
If connectors are integrated into the substrate, then ease of connection to external power source is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements multi-functionality by integrating both electrical connection functions (power supply and signal transmission) and mechanical connection functions (structural support and alignment) into the substrate and its terminals. The terminals extend from the substrate to provide electrical connections, while the substrate itself provides mechanical support and positioning, reducing the need for separate connection components and simplifying the overall assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation from light emitting diode chips and facilitates easy connection to external power sources, reducing failure risks and improving the package's thermal management.
Implementation Method 1
A light emitting diode refers to an inorganic semiconductor device that emits light through recombination of electrons and holes
Implementation Method 2
a reflector coupled to an upper portion of the substrate and having an opening exposing the plurality of light emitting diode chips
Data Source
AI summary
A light-emitting diode package comprising: a substrate having one or more first pads, one or more second pads, a first terminal, and a second terminal, which are all formed on the upper surface; a plurality of light-emitting diode chips loaded on the one or more first pads and electrically connected to the first pad and the second pad; and a reflector coupled to an upper part of the substrate and having an opening part through which the plurality of light-emitting diode chips is exposed, wherein the first pad is formed as one body with the substrate, and the first terminal or the second terminal are connected to an external power source and formed to have a predetermined height at the upper surface of the substrate.