LED Package Thermoelectric Cooling Integration
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Solution Overview
Problem
Conventional LED package structures face challenges in heat dissipation, leading to reduced light emitting efficiency and shortened service life due to the complexity of assembly and inefficiency of heat sinking methods.
Innovation Solution
Integration of a thermoelectric cooling device with the LED module using a micro-electromechanical process on silicon substrates, reducing thermal resistance and enhancing heat dissipation efficiency by minimizing the distance between the cooling device and the LED chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive agent is used to assemble the LED holder and the TE cooler, then the components can be bonded together, but the assembly process becomes complicated and the bonding is affected by thermal expansion during heating
Solution Approach 1:
The LED holder and TE cooler are integrated into a single unified structure where the TE cooler is directly mounted on the LED holder without requiring separate adhesive bonding steps. This merging eliminates the complexity of multi-component assembly while maintaining strong thermal and mechanical coupling between the components
Solution Approach 2:
A thermal interface material or direct thermal contact structure serves as an intermediary between the LED holder and TE cooler, providing both mechanical support and efficient thermal conduction. This intermediary ensures reliable bonding and heat transfer while accommodating thermal expansion differences between components
2Strength
If adhesive agent is used to assemble the TE cooler and the heat sink, then the components can be bonded together, but the assembly process becomes complicated and the desired heat sinking effect cannot be achieved
Solution Approach 1:
The TE cooler and heat sink are merged into a closely integrated assembly where the TE cooler is directly coupled to the heat sink. This eliminates the thermal resistance introduced by adhesive layers and ensures efficient heat transfer from the LED through the TE cooler to the heat sink, achieving the desired heat sinking effect
Solution Approach 2:
The adhesive agent is extracted or eliminated from the thermal path between the TE cooler and heat sink. By removing the adhesive layer that impedes heat flow, the design achieves direct thermal contact and maximizes heat dissipation efficiency while maintaining structural integrity through alternative mechanical coupling methods
3Strength
If conventional assembly methods are used, then components can be joined, but the distance between the cooling device and LED chip is large, reducing heat dissipation efficiency
Solution Approach 1:
The TE cooler is nested directly within or adjacent to the LED holder structure, with the cooling elements positioned in immediate proximity to the LED chip. This nested arrangement minimizes the thermal path length and ensures efficient heat extraction from the LED chip while maintaining structural stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat sinking ability, increases light emitting efficiency, and extends the service life of LED elements while simplifying the packaging process and enhancing assembly reliability.
Implementation Method 1
The thermoelectric cooling device is arranged between the second surface of the first substrate and the third surface of the second substrate for conducting heat generated by the LED chip during operation
Data Source
AI summary
A light emitting diode (LED) package structure including a first substrate, one or more LED chips, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface and a corresponding second surface. The LED chip suitable for emitting a light is arranged on the first surface of the first substrate, and is electrically connected to the first substrate. The second substrate is below the first substrate, and has a third surface and a corresponding fourth surface. The third surface faces the second surface. The thermoelectric cooling device is arranged between the second surface of the first substrate and the third surface of the second substrate for conducting heat generated by the LED chip during operation.