LED Package Terminals with Variable Widths for Reliable Bonding
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Solution Overview
Problem
Conventional light emitting diode packages with terminals of the same size and shape face reliability issues during electrical testing and bonding to printed circuit boards due to restricted width and spacing, leading to potential failures.
Innovation Solution
The light emitting diode package design includes terminals with different widths, with specific terminals having a greater width than others to improve reliability during electrical testing and bonding, featuring a lead frame with distinct terminal groups and a package body that supports these terminals, ensuring proper spacing and preventing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If terminals of the same size and shape are used in conventional LED packages, then the package structure is simple and easy to manufacture, but the terminals have restricted width and spacing which causes failure during electrical testing and bonding
Solution Approach 1:
The patent applies local quality by making different terminals have different widths according to their specific functional requirements. Test terminals have greater width to accommodate testing equipment probes and ensure reliable electrical contact during testing, while bonding terminals have optimized width for PCB mounting. This localized differentiation of terminal properties resolves the contradiction between reliability and complexity.
Solution Approach 2:
The patent changes the geometric parameters of terminals, specifically the width parameter, to optimize performance. By varying terminal width as a key parameter, the design accommodates different functional needs (testing vs. bonding) within the same package structure, improving electrical testing reliability without requiring complete structural redesign.
2Reliability
If terminals of the same size and shape are used, then manufacturing is simplified, but the terminals cannot be properly spaced to prevent short circuits during bonding to printed circuit boards
Solution Approach 1:
Different terminals are assigned different widths based on their specific bonding requirements. Bonding terminals have width and spacing optimized for PCB land pattern alignment and solder joint formation, preventing short circuits. This localized optimization of terminal dimensions ensures reliable bonding while maintaining a relatively simple overall package structure.
Solution Approach 2:
The terminal structure is segmented into different types (test terminals with greater width, bonding terminals with optimized dimensions) rather than using a uniform design. This segmentation allows each terminal type to be independently optimized for its specific function, improving bonding reliability without requiring complex inter-terminal connections.
3Reliability
If uniform terminals are used, then the lead frame design is simpler, but electrical testing fails due to insufficient terminal width for proper contact
Solution Approach 1:
Test terminals are specifically designed with greater width to ensure adequate contact area with testing equipment probes. This localized increase in terminal width at test-specific locations ensures reliable electrical contact during testing operations, while other terminals maintain dimensions suited for their respective functions. The principle of local quality allows the lead frame to accommodate different testing and bonding requirements without requiring complete redesign of all terminals.
Data Source
AI summary
Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal and a second terminal, and in at least one of the first terminal group and the second terminal group, the first terminal is connected to the chip area and the second terminal is separated from the chip area. The first terminal has a first width, the second terminal has a second width, and the first width is different than the second width.