LED Package Structure With Exposed Test Pads for Calibration

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Solution Overview

Problem

Existing LED package structures do not allow for calibration of characteristic parameters of LED light sources, leading to undesirable shifts in brightness or color temperature, even when LEDs have the same color and are driven under the same conditions.

Innovation Solution

A light emitting device comprising a circuit substrate with upper and lower electrical connecting pads, test paths, and operation paths, where light emitting elements and a control element are arranged on the substrate, and a sealing structure covers them, allowing for testing and calibration of the light emitting elements before use.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If LED package structures are sealed together, then protection and integration are improved, but calibration capability deteriorates

Engineering Contradiction:
Improveprotection and integrationVSAvoidcalibration capability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent provides preliminary action by establishing test paths and testing pads that enable calibration to be performed before the LED package is sealed. The test paths are pre-configured in the circuit substrate to connect testing pads to light emitting elements, allowing characteristic parameters to be measured and recorded prior to final packaging. This resolves the contradiction by ensuring calibration capability exists before sealing occurs.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces an intermediary mechanism through the control element that mediates between the testing pads and the light emitting elements. The control element receives test signals through testing pads, measures characteristic parameters of light emitting elements, and stores the measured data. This intermediary enables calibration functionality without requiring the package to remain open, thus maintaining both protection and calibration capability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Illumination intensity

If multiple light sources are used, then brightness and color quality are improved, but circuit complexity increases

Engineering Contradiction:
Improvebrightness and color qualityVSAvoidcircuit complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent merges multiple light emitting elements (red, green, blue LEDs) onto a single circuit substrate with integrated control. Instead of separate circuits for each LED, the invention combines all light sources and their control pathways into one unified package structure, reducing overall circuit complexity while maintaining the ability to produce full-color illumination with adjustable brightness and color quality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The circuit substrate is designed with universal test paths and electrical connecting pads that can serve multiple functions: they enable testing of individual light emitting elements, support calibration operations, and provide drive signals for operation. This multi-functionality reduces the need for separate dedicated circuits for each LED, thereby simplifying the overall circuit design while supporting multiple light sources.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12347736B2Light emitting device
Publication Date: 2025.07.01 LITE ON OPTO TECH (CHANGZHOU) CO LTD
  • US12347736B2 patent drawing
  • US12347736B2 patent drawing
  • US12347736B2 patent drawing

AI summary

A light emitting device includes a circuit substrate, a plurality of light emitting elements, a control element, and a sealing structure. The circuit substrate has a plurality of upper electrical connecting pads at the top thereof and a plurality of testing pads and a plurality of lower electrical connecting pads at the bottom thereof. The light emitting elements are arranged on the circuit substrate. The control element is arranged on the circuit substrate and electrically connected to the light emitting elements. The sealing structure is configured to cover the light emitting elements and the control element, and the testing pads of the circuit substrate are exposed from the sealing structure for testing respective characteristic parameter values of the light emitting elements.