LED Package Thermal Conductivity Gradient
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting diode (LED) packages face challenges in efficiently dissipating heat energy, leading to thermal resistance issues and reduced light emission efficiency.
Innovation Solution
The light emitting device package incorporates a package body with lower thermal conductivity than the encapsulation layer, utilizing electrodes and a lens part with higher thermal conductivity to create a heat dissipation path, effectively transferring heat away from the LED.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the package body uses a material with high thermal conductivity to improve heat dissipation, then heat dissipation characteristic is improved, but the encapsulation layer cannot effectively guide heat to the electrodes
Solution Approach 1:
The patent applies local quality by creating a thermal conductivity gradient within the encapsulation layer. The first region (near the LED chip) has higher thermal conductivity to efficiently collect heat, while the second region (near the electrodes) has lower thermal conductivity to maintain heat flow direction. This spatial variation in material property enables the encapsulation layer to actively guide heat toward the electrodes rather than allowing random heat distribution.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the encapsulation layer material by using different materials or compositions in different regions. Specifically, the first region uses a material with thermal conductivity of 0.5-5.0 W/mK while the second region uses material with 0.1-0.5 W/mK. This parameter change enables the encapsulation layer to perform dual functions: heat collection and heat guidance.
2Ease of manufacture
If the package body uses the same material as the encapsulation layer, then manufacturing is simplified, but heat dissipation efficiency is reduced
Solution Approach 1:
The patent segments the encapsulation layer into two distinct regions with different thermal conductivity characteristics. The first region (contacting the LED chip) and the second region (contacting the electrodes) are formed with different material compositions or structures. This segmentation allows each region to perform its specific thermal management function optimally while still being part of a single encapsulation layer component.
Solution Approach 2:
The patent employs composite materials strategy by combining different materials or material compositions within the encapsulation layer. The first region may use a phosphor resin composite with specific thermal properties, while the second region uses a different composite formulation. This composite approach enables tailoring of thermal conductivity in each region to achieve optimal heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation characteristics, reducing thermal resistance and peak temperature, and enhancing light emission efficiency compared to conventional packages.
Implementation Method 1
The package body includes a material having thermal conductivity lower than thermal conductivity of a material constituting the encapsulation layer
Implementation Method 2
utilizing electrodes and a lens part with higher thermal conductivity to create a heat dissipation path, effectively transferring heat away from the LED
Data Source
AI summary
Disclosed is a light emitting device package. The light emitting device package includes a package body, a light emitting device installed in a cavity of the package body, an encapsulation layer to seal the light emitting device, and an electrode connected to the light emitting device. The package body includes a material having thermal conductivity lower than thermal conductivity of a material constituting the encapsulation layer.