LED Package Thermal Management via Segmented Arrays
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Solution Overview
Problem
Conventional LED mounting arrangements result in inefficient light distribution and heat dissipation, leading to color uniformity issues and increased material costs, with existing heat dissipation methods being aesthetically unpleasing and inefficient.
Innovation Solution
The use of thermally conductive materials and strategically arranged LED arrays on printed circuit boards, with T-shaped or ladder structures to balance heat dissipation, color uniformity, and brightness, while minimizing material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LEDs are arranged closer together to increase brightness, then illumination intensity is improved, but heat dissipation deteriorates due to concentrated heat generation in a smaller area
Solution Approach 1:
The LED array is divided into multiple segments with individual heat sinks for each LED or group of LEDs. This segmentation allows heat to be distributed across multiple heat dissipation paths rather than concentrated in a single large heat sink, enabling closer LED placement while maintaining effective heat dissipation.
Solution Approach 2:
The patent transitions from planar heat dissipation to three-dimensional heat sink structures with vertical fins and extended surfaces. This dimensional change increases the heat dissipation surface area without increasing the horizontal footprint, allowing higher LED density while maintaining temperature control.
2Temperature
If conventional heat dissipation methods like aluminum extrusions are used, then heat dissipation is improved, but device complexity and material cost increase
Solution Approach 1:
The heat sink structure is merged with the mounting bracket and housing components, eliminating the need for separate complex heat dissipation assemblies. The structural support elements simultaneously serve as heat conduction paths, reducing both material cost and structural complexity.
Solution Approach 2:
The heat sink components perform multiple functions: they provide thermal management, structural support, and mechanical mounting for the LEDs. This multi-functionality eliminates the need for dedicated separate components, simplifying the overall device structure.
3Illumination intensity
If LEDs are placed closer together to increase brightness, then illumination intensity is improved, but color uniformity deteriorates due to yellow light concentration at cone edges
Solution Approach 1:
The patent employs individual optical lenses or diffusers for each LED that are specifically designed to control the emission pattern of that particular LED. This local optical control ensures that each LED's light distribution is optimized, maintaining color uniformity even when LEDs are closely spaced.
Solution Approach 2:
A diffuser material or optical intermediate layer is placed between the LEDs and the final illumination area. This intermediary element scrambles and redistributes the light from multiple LEDs, blending the spectral characteristics and eliminating the yellow ring effect caused by edge emission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively enhances light distribution and heat dissipation, maintaining color uniformity and reducing material costs, while allowing for adjustable brightness levels in various lighting applications.
Implementation Method 1
The use of thermally conductive materials and strategically arranged LED arrays on printed circuit boards, with T-shaped or ladder structures to balance heat dissipation
Data Source
Figure 1A~1C
Figure 2A~3
Figure 4A~4B
AI summary
Lighting packages are described for light emitting diode (LED) lighting solutions having a wide variety of applications which seek to balance criteria such as heat dissipation, brightness, and color uniformity. The present approach includes a backing of thermally conductive material and two or more arrays of LEDs attached to a printed circuit board (PCB). The PCB is attached to the top surface of the backing and the two or more arrays of LEDs are separated by a selected distance to balance heat dissipation and color uniformity of the LEDs.