LED Package Thermal Via Heat Dissipation
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Solution Overview
Problem
Chip packages, particularly those for LED chips, face heat dissipation challenges that negatively impact performance and lifespan due to inadequate thermal management.
Innovation Solution
A light emitting diode package is designed with a semiconductor substrate featuring a thermal via extending from one surface to the other, covered by an insulating layer and a conducting layer, and filled with a thermal conductive material to enhance heat dissipation, along with a method for forming this structure that includes creating through-holes and heat dissipation holes and filling them with thermal conductive material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If LED chips operate with increased functionality, then performance and output are improved, but heat generation increases which negatively affects performance and lifespan
Solution Approach 1:
The patent extracts heat from the LED chip by creating thermal vias that conduct heat away from the chip substrate. The thermal vias are filled with high thermal conductivity material to efficiently extract heat generated during LED operation, preventing heat accumulation that would otherwise degrade performance and lifespan.
Solution Approach 2:
The patent introduces an intermediary thermal via structure between the LED chip and the external environment. This thermal via acts as a heat transfer medium, conducting heat from the chip substrate through the insulating layer to external heat sinks, thereby managing thermal effects without directly modifying the LED chip itself.
2Temperature
If thermal vias are added to improve heat dissipation, then temperature control is improved, but device structure becomes more complex
Solution Approach 1:
The patent merges multiple functions into the thermal via structure. The thermal via serves both as a heat conduction path and as part of the overall package structure. By combining thermal management with the packaging architecture, the design avoids adding separate, complex cooling systems while still achieving effective heat dissipation.
Solution Approach 2:
The patent applies local quality by concentrating thermal management resources at the heat source. Rather than uniformly cooling the entire package, thermal vias are strategically positioned at locations where heat generation is highest, such as near the LED chip mounting area. This localized approach achieves effective heat dissipation with minimal structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves heat dissipation, maintaining the positive characteristics and extending the lifespan of LED chips by efficiently managing thermal issues within the chip package.
Implementation Method 1
a thermal via formed extending from the second surface toward the first surface of the semiconductor substrate, wherein the thermal via has a first end near the first surface and a second end near the second surface
Data Source
AI summary
A light emitting diode package is provided, which includes a semiconductor substrate having a first surface and a second surface; at least a through-hole passing through the semiconductor substrate; a thermal via formed extending from the second surface toward the first surface of the semiconductor substrate, wherein the thermal via has a first end near the first surface and a second end near the second surface; an insulating layer overlying a sidewall of the through-hole and extending overlying the first surface and the second surface of the semiconductor substrate, wherein the insulating layer further covers at least one of the first end, the second end and a sidewall of the thermal via; a conducting layer overlying the insulating layer in the through-hole and extending to the first surface and the second surface of the semiconductor substrate; and an LED chip disposed overlying the semiconductor substrate.