LED Package Structure With Local Thermoelectric Cooling

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Solution Overview

Problem

Existing LED packaging methods inadequately address heat dissipation, leading to potential damage and premature failure of nearby components due to heat generated by the light-emitting element.

Innovation Solution

Incorporation of a thermoelectric element within the light-emitting package that transfers heat generated by the light-emitting element to the back surface of the substrate, reducing the package's temperature and mitigating damage to nearby components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a light-emitting element is integrated into a semiconductor package, then the device functionality is enhanced, but heat generated by the light-emitting element causes damage to nearby components

Engineering Contradiction:

Improvedevice functionalityVSAvoidheat damage to components

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the heat dissipation function from the traditional packaging structure by introducing a dedicated thermoelectric element. This element is specifically designed to extract heat from the light-emitting element and transfer it to a heat sink, separating the light emission function from the heat management function to prevent thermal damage to surrounding components.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The thermoelectric element acts as an intermediary between the light-emitting element and the heat sink. It facilitates heat transfer from the light-emitting element to the heat sink through controlled thermal conduction, preventing direct thermal exposure of nearby components while maintaining the functional integration of the package.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If traditional packaging methods are used, then the structure is simple, but heat dissipation is inadequate leading to premature failure

Engineering Contradiction:

Improvepackage structureVSAvoidcomponent lifespan

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent implements preliminary heat management by incorporating the thermoelectric element and heat sink into the package structure before the light-emitting element operates. This proactive heat dissipation system prevents heat accumulation that would otherwise lead to premature component failure, ensuring reliable operation from the start.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The package employs a composite structure combining the light-emitting element, thermoelectric element, and heat sink materials. This multi-material construction integrates both optical emission and thermal management functions within a single package, achieving improved reliability without excessive complexity.

Inventive Principle:

Principle #40Composite materials

3Device complexity

If heat is allowed to accumulate, then the package structure remains simple, but nearby components suffer thermal damage

Engineering Contradiction:

Improveheat management structureVSAvoidthermal damage

Core Design Contradiction:

Device complexityVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful heat generated by the light-emitting element into a manageable thermal flow by directing it through the thermoelectric element to the heat sink. This approach transforms waste heat from a damaging byproduct into a controlled thermal transfer process, preventing thermal damage while maintaining system efficiency.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermoelectric element effectively cools the light-emitting element, reducing the risk of damage to nearby components and enhancing the overall performance of the light-emitting package by managing heat effectively.

Implementation Method 1

one or more thermoelectric elements electrically coupled to the light-emitting element. The thermoelectric element may be configured for local cooling of the light-emitting element

Methodology Applied

Scientific EffectThermoelectric effect: Peltier Effect

Data Source

PatentUS20240038949A1Light-emitting package and forming method thereof

Publication Date: 2024.02.01 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A light-emitting package and a method for forming a light-emitting package are provided. The light-emitting package includes a substrate, an interconnection structure and a thermoelectric element. The interconnection structure is disposed over the substrate. The interconnection structure comprises a light-emitting element. The thermoelectric element penetrates through the substrate, extends into the interconnection structure and stops at the light-emitting element. The thermoelectric element is configured for local cooling of the light-emitting element.