LED Package With Through-Hole Fluorescent Colloids and Peripheral Wiring
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Solution Overview
Problem
Existing LED package structures, such as those using wire-bonding and flip-chip methods, face issues like shadowed light projection due to wire placement, increased manufacturing costs, reduced efficiency, and light refraction, which affect light-emitting efficiency.
Innovation Solution
An LED package structure featuring a substrate with through holes for fluorescence colloids, where LEDs are wire-bonded and covered with opaque units to eliminate shadowing, and light is condensed using opaque blocks and lead angle portions, while antistatic units prevent static damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire-bonding method is used to connect LED electrodes to substrate, then manufacturing cost is reduced and process is simplified, but shadow lines are projected on LED affecting light-emitting efficiency
Solution Approach 1:
The harmful wires are extracted and relocated to the periphery of the substrate, away from the central light-emitting area. The wires are positioned along the edges where they do not intersect with the light path from the LED to the observer, thereby eliminating shadow lines while preserving the cost-effective wire-bonding process.
Solution Approach 2:
The wire arrangement transitions from a planar configuration that intersects the light path to a three-dimensional peripheral arrangement. By positioning wires along the substrate edges and using vertical bonding angles, the wires are moved out of the two-dimensional light projection plane, eliminating shadows without changing the fundamental wire-bonding process.
2Illumination intensity
If flip-chip method is used to connect LED to substrate, then shadow lines are eliminated and light-emitting efficiency is maintained, but manufacturing cost increases and process complexity increases
Solution Approach 1:
Instead of inverting the LED chip as in flip-chip method, the substrate and wire arrangement are inverted. The wires are positioned peripherally and bonded at edge locations rather than centrally, achieving shadow elimination through spatial reconfiguration rather than chip orientation change.
3Illumination intensity
If flip-chip method is used, then shadow lines are eliminated, but light loss occurs due to refraction under the LED
Solution Approach 1:
The substrate is segmented into a light-emitting central area and a peripheral wire-bonding area. This segmentation allows the light path to remain clear and unobstructed in the central region, preventing refraction-related light loss while enabling wire connections at the periphery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances light-emitting efficiency by eliminating shadowed areas and reducing light loss, maintaining original efficiency without the need for expensive professional equipment or complex flip-chip processes.
Implementation Method 1
a fluorescence colloid 4a is covered on the LED 2a and two corresponding wires 3a for protecting the corresponding LED 2a
Data Source
AI summary
An LED package structure for increasing light-emitting efficiency includes: a substrate unit, and a plurality of fluorescence colloid units, LED units, conductive units and opaque units. The substrate unit has a main body and a plurality of through holes passing through the main body. Each fluorescence colloid unit is received in the corresponding through hole and having an installed surface. Each LED unit has a light-emitting surface disposed on the corresponding fluorescence colloid unit and facing the installed surface of the corresponding fluorescence colloid units. Each conductive unit is electrically connected between each two electrode areas that have the same pole and are respectively arranged on each LED unit and the main body. Each opaque unit is disposed on two corresponding lateral faces of the main body for covering the installed surface of the corresponding fluorescence colloid unit, the corresponding LED unit, and the corresponding conductive units.