Light Emitting Device Package With Through-Hole Frames
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Solution Overview
Problem
Current semiconductor device packages face challenges in enhancing light extraction efficiency, electrical characteristics, and manufacturing efficiency while maintaining cost-effectiveness and preventing re-melting phenomena during re-bonding processes.
Innovation Solution
A light emitting device package design featuring multiple frames with conductive layers in through-holes, a connecting frame, and a resin material to improve adhesion and conductivity, allowing for selective switching of light emitting devices and reducing manufacturing costs by optimizing the package structure and process efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional semiconductor device packages are used, then manufacturing process is simple, but light extraction efficiency is insufficient
Solution Approach 1:
The package structure is divided into multiple frames (first frame, second frame, third frame) with through-holes positioned at specific locations. This segmentation allows light to be extracted through multiple pathways simultaneously, improving overall light extraction efficiency while maintaining a manageable manufacturing process for each individual frame component
Solution Approach 2:
Through-holes are introduced as a vertical dimension feature penetrating through the frame structure. This adds a new light extraction dimension perpendicular to the conventional planar extraction path, enabling light to escape through the thickness of the package rather than only laterally, thereby significantly improving light extraction efficiency
2Device complexity
If conventional package structures are used, then device complexity is low, but electrical characteristics are insufficient
Solution Approach 1:
The electrical connection system is segmented into multiple conductive layers positioned at different locations and orientations. These separate conductive paths provide redundant electrical connections and improve signal integrity without requiring a completely complex reconfiguration of the entire package structure
Solution Approach 2:
Conductive layers are introduced as intermediary elements between the semiconductor device and the external circuitry. These intermediary conductive paths improve electrical characteristics by providing controlled impedance paths and reducing interference, while the overall package structure remains relatively simple
3Ease of manufacture
If conventional bonding processes are used, then manufacturing cost is low, but re-melting phenomena occur during re-bonding
Solution Approach 1:
Through-holes are pre-formed in the frame structure before final assembly and bonding operations. This preliminary structural preparation allows for better heat dissipation pathways to be established in advance, preventing re-melting phenomena during subsequent re-bonding processes while maintaining cost-effective manufacturing
Solution Approach 2:
The frame structure with through-holes provides beforehand thermal management capability that cushions against excessive heat buildup during re-bonding operations. This preemptive thermal pathway prevents the bonding material from reaching melting temperatures again, ensuring bonding stability without requiring expensive alternative bonding processes
4Productivity
If light emitting devices are densely packed, then productivity is high, but light extraction efficiency decreases
Solution Approach 1:
The package is divided into multiple frames with distributed through-holes, creating multiple discrete light extraction zones. This segmentation allows light emitting devices to be densely packed in each zone while maintaining effective light extraction pathways through the through-holes, preventing the trade-off between density and extraction efficiency
Solution Approach 2:
By introducing vertical through-holes as an additional light extraction dimension, the system can accommodate higher device packing densities in the planar direction without sacrificing light extraction efficiency. Light can escape through the vertical dimension via through-holes, decoupling the relationship between packing density and extraction efficiency
Data Source
AI summary
A light emitting device package is discussed. The light emitting device package includes a first frame having a first through hole; a second frame having a second through hole; a connecting frame diagonally extending in the light emitting device package from the first frame to the second frame; a first light emitting device including a first electrode pad and a second electrode pad, the second electrode pad being disposed on the first through hole of the first frame; and a second light emitting device including a third electrode pad and a fourth electrode pad, the third electrode pad being disposed on the second through hole of the second frame.