Wafer Level LED Package Carrier with Through Holes

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Solution Overview

Problem

Conventional light emitting diode (LED) manufacturing processes are complex and prone to erroneous alignments, and the addition of heat dissipating structures increases costs without fully addressing heat dispersion effectively.

Innovation Solution

A wafer level package method where a light emitting diode structure is grown on a substrate, with the substrate used to precisely align and bond the LEDs onto a package carrier with through holes and conducting material, followed by removal of the substrate and encapsulation with package material, utilizing a silicon package carrier for improved heat dissipation and mechanical support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional SMD-type LED packaging process is used with epoxy encapsulation, then the LED structure is protected, but the manufacturing process becomes complicated and alignment errors occur easily

Engineering Contradiction:

Improveprotective functionVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the substrate into the package carrier structure, eliminating the need for separate epoxy encapsulation. The package carrier integrates both mechanical support and protective functions, while the wafer-level bonding process combines multiple steps into a single batch operation, reducing process complexity and alignment errors.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the epoxy encapsulation material from the final package structure. Instead of using epoxy to protect the LED, the design uses the package carrier itself as the protective enclosure, with LEDs mounted on the carrier's surface and ledges providing mechanical protection without requiring additional encapsulants.

Inventive Principle:

Principle #2Taking out (Extraction)

2Temperature

If heat dissipating structure is added to lead frame, then heat dissipation is improved, but the cost increases

Engineering Contradiction:

Improveheat dissipationVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The package carrier is designed to perform multiple functions simultaneously: it provides mechanical support for the LEDs, serves as a heat dissipation structure through its thermally conductive material and heat dissipation layer, and acts as the final package enclosure. This multi-functionality eliminates the need for separate heat dissipation components, reducing cost while maintaining effective heat management.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The package carrier's structure is designed to inherently provide heat dissipation through its material composition (metal substrate with heat dissipation layer) and geometric features (ledges, through holes), without requiring additional active cooling components or complex thermal management systems. The structure serves its own thermal management needs.

Inventive Principle:

Principle #25Self-service

3Productivity

If wafer level package method is used with substrate bonding, then manufacturing process is simplified and alignment is precise, but new bonding process requirements are introduced

Engineering Contradiction:

Improveproduction yieldVSAvoidbonding process requirements

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent performs preliminary actions by pre-forming the package carrier with integrated bonding structures (through holes, conducting material, ledges) before LED mounting. The substrate and package carrier are prepared in advance with alignment features and bonding interfaces, enabling precise wafer-level bonding without requiring complex real-time alignment procedures during assembly.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies the manufacturing process, ensures precise alignment, enhances production yield, and improves LED performance by providing effective heat dissipation and mechanical support, while allowing for miniaturization and easy production of single or multiple LED structures.

Implementation Method 1

the light emitting diode structure (32) includes a p-electrode (33) and an n-electrode (34)

Methodology Applied

Scientific EffectLight emitting diode electroluminescence: Electroluminescence

Implementation Method 2

utilizing a silicon package carrier for improved heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8097476B2Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package

Publication Date: 2012.01.17 EPILEDS TECH

AI summary

This invention discloses a light emitting diode, a wafer level package method, a wafer level bonding method, and a circuit structure for a wafer level package. The light emitting diode includes a package carrier, a conducting material, at least one light emitting diode structure and a package material. The package carrier has at least one package unit and two through holes on the package carrier and corresponding to the package unit. The conducting material is disposed in the through holes and formed at the bottom of the package unit. The light emitting diode structure is formed on a substrate. The substrate having a light emitting diode structure is flipped over in the package unit, and the electrodes of the light emitting diode structure are bonded with the conducting material. After the substrate is removed, a package material is stuffed in the package unit or on the light emitting diode structure.