Light Emitting Device Package With Through Holes And Recesses
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Solution Overview
Problem
Current semiconductor device packages face challenges in improving light extraction efficiency, electrical characteristics, and manufacturing costs, while also experiencing issues with bonding strength and re-melting during re-bonding to circuit boards.
Innovation Solution
The design incorporates a light emitting device package with specific frame and body structures, including through holes and recesses, where a conductive layer is placed in the through holes and a resin is disposed in the recesses, enhancing adhesive force and electrical conductivity, and optimizing the package structure to prevent re-melting and improve manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional semiconductor device package structure is used, then the manufacturing process is simple, but the light extraction efficiency is insufficient
Solution Approach 1:
The package structure is divided into multiple functional components: a body with through holes, frames, recesses, and separate conductive layers. This segmentation allows each component to perform its specific function optimally - the through holes extract light while the conductive layers provide electrical connections, resolving the contradiction between manufacturing simplicity and light extraction efficiency
Solution Approach 2:
The invention introduces vertical through holes penetrating the package body, adding a vertical dimension to light extraction. This three-dimensional structure enables light to be extracted from multiple directions (top and bottom surfaces), significantly improving light extraction efficiency without complicating the manufacturing process excessively
2Reliability
If the bonding strength is increased to improve reliability, then the adhesive force is enhanced, but re-melting occurs during re-bonding to circuit boards
Solution Approach 1:
The package uses different materials with different thermal properties in different locations: the conductive layers provide strong adhesive force at bonding interfaces, while the body material (epoxy resin with filler particles) provides high heat resistance. This local differentiation allows the bonding regions to have high adhesion without the entire package being vulnerable to re-melting
Solution Approach 2:
The package body is constructed as a composite material consisting of epoxy resin matrix combined with inorganic filler particles (such as aluminum oxide or aluminum nitride). This composite structure provides both the adhesive properties needed for bonding and the thermal stability required to prevent re-melting during re-bonding processes
3Reliability
If the electrical conductivity is improved by adding conductive layers, then the electrical characteristics are enhanced, but the device complexity increases
Solution Approach 1:
The conductive layers in the through holes serve multiple functions simultaneously: they provide electrical conductivity for signal transmission, mechanical support for the package structure, and thermal management pathways. This multi-functionality improves electrical characteristics without proportionally increasing device complexity
Solution Approach 2:
The invention merges the electrical conduction function with the structural support function by placing conductive layers within the through holes of the package body. This integration allows a single structural feature (the through hole with conductive layer) to fulfill both mechanical and electrical requirements, avoiding the need for separate complex electrical interconnection structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light extraction efficiency, electrical characteristics, and reliability, while reducing manufacturing costs and preventing re-melting during re-bonding, thereby improving the overall performance and stability of the semiconductor device package.
Implementation Method 1
a conductive layer is placed in the through holes and a resin is disposed in the recesses, enhancing adhesive force and electrical conductivity
Implementation Method 2
a conductive layer is placed in the through holes and a resin is disposed in the recesses, enhancing adhesive force and electrical conductivity
Data Source
AI summary
The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device disposed on the first and second frames; a first resin disposed between the body and the light emitting device, wherein each of the first and second frames includes a through hole, the through hole overlaps the light emitting device in a vertical direction, and the body includes a recess recessed toward a lower surface of the body between the first and second frames, and the recess overlaps the light emitting device in the vertical direction, the first resin is disposed in the recess, and a length of the recess is smaller than a width of the light emitting device.