LED Package Transparent Electrode for Uniform Voltage
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Solution Overview
Problem
Current light emitting device packages for display devices face challenges in reducing manufacturing costs and miniaturization, with variations in driving voltages among LED chips leading to non-uniform color characteristics and increased complexity in electrode connections.
Innovation Solution
A light emitting device package design featuring three LED chips with different wavelengths, a transparent electrode layer, and a through electrode portion, encapsulated by a molding portion, which allows for uniform voltage application and reduced manufacturing complexity by eliminating the need for separate electrode patterns and wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate electrode patterns and wiring are used for each LED chip, then individual electrode connections can be made, but manufacturing complexity increases and miniaturization becomes difficult
Solution Approach 1:
The patent merges the electrode connections for multiple LED chips into a single common electrode structure. The transparent electrode layer serves as a common electrode that simultaneously connects to multiple LED chips, eliminating the need for separate electrode patterns and wiring for each chip. This consolidation reduces manufacturing complexity and enables easier miniaturization of the display device.
Solution Approach 2:
The transparent electrode layer performs multiple functions: it serves as a common electrode for multiple LED chips, provides electrical connection, and maintains structural integrity. This multi-functional design reduces the number of separate components needed, simplifying the overall device structure and manufacturing process.
2Reliability
If different driving voltages are applied to LED chips, then individual chip characteristics can be optimized, but color uniformity deteriorates
Solution Approach 1:
The patent implements equipotentiality by connecting multiple LED chips to the same common electrode, ensuring that all chips receive the same driving voltage. This uniform voltage application across all LED chips maintains consistent color characteristics and ensures color uniformity throughout the display device.
3Volume of moving object
If the package size is reduced for miniaturization, then display device compactness improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the electrode connection function into a modular common electrode structure that can be independently fabricated and then integrated with LED chips. This segmentation allows for precise positioning and alignment during assembly, facilitating miniaturization while maintaining manufacturing precision through standardized interfaces and alignment features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces manufacturing costs and enables easy miniaturization while ensuring uniform color characteristics across sub-pixels by allowing the same driving voltage to be applied to all LED chips, improving the efficiency and consistency of light emission.
Implementation Method 1
three light emitting diode (LED) chips configured to emit light having different wavelengths, each of the three LED chips including a light emitting structure having a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer
Data Source
AI summary
A light emitting device package is provided. The light emitting device package includes three light emitting diode (LED) chips configured to emit light having different wavelengths, each of the three LED chips including a light emitting structure having a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; a through electrode portion disposed adjacent to the three LED chips; a molding portion encapsulating respective side surfaces of the three LED chips and the through electrode portion; a transparent electrode layer disposed on a first surface of the molding portion, the three LED chips, and the through electrode portion; and three individual electrodes exposed through a second surface of the molding portion and disposed on the three LED chips, respectively.