LED Package Trenches and Metallic Plating for Light Extraction
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Solution Overview
Problem
Current light emitter packages are costly and inefficient, lacking in brightness and light extraction, which hinders their adoption as replacements for traditional lighting solutions.
Innovation Solution
The development of light emitter packages that incorporate novel LED chips, optimized chip-to-chip spacing, exposed metallic traces, and reflective materials within trenches to enhance light reflection and extraction, along with optical conversion materials for improved brightness and color consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional LED packages are used, then manufacturing cost is reduced, but brightness and light extraction efficiency deteriorate
Solution Approach 1:
The package is divided into multiple LED chips arranged in a specific pattern on the substrate, with each chip contributing to the overall light output. This segmentation allows optimization of individual chip performance while maintaining cost-effective manufacturing through standardized substrate designs.
Solution Approach 2:
Different regions of the package are assigned different functions: LED chips are positioned in light-emitting zones, trenches are created for light extraction enhancement, and metallic plating is applied selectively to specific areas. This local differentiation optimizes brightness where needed while controlling manufacturing complexity.
2Loss of energy
If conventional LED packages are used, then manufacturing simplicity is maintained, but light extraction efficiency deteriorates
Solution Approach 1:
The package structure is segmented into functional zones including LED chip mounting areas, trenches for light extraction, and metallic plating regions. This segmentation enables targeted optimization of light extraction pathways without requiring complete redesign of the entire package.
Solution Approach 2:
Trenches are introduced as a vertical dimension feature in the package structure, creating three-dimensional light extraction pathways. This adds complexity in one dimension while maintaining simplicity in other dimensions, overall improving light extraction efficiency.
3Illumination intensity
If fewer LED chips are used, then manufacturing cost is reduced, but brightness deteriorates
Solution Approach 1:
The package design changes parameters such as chip arrangement pattern, trench dimensions, and metallic plating configuration to maximize light extraction efficiency. These parameter optimizations enable fewer chips to achieve the same brightness output, reducing material costs.
Solution Approach 2:
The package structure converts potential light loss pathways into beneficial extraction pathways through strategically positioned trenches and metallic plating. This transforms what would be wasted light into useful output, improving brightness per chip.
4Productivity
If more LED chips are used, then brightness is improved, but manufacturing cost increases
Solution Approach 1:
The package optimizes parameters including chip spacing, trench depth and width, and metallic plating thickness to maximize lumens per Watt ratio. These parameter adjustments improve productivity metrics without requiring proportional increases in chip count or manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These packages achieve higher lumens per Watt (LPW) ratings, up to 200 LPW at 1 W and 25°C, with improved color consistency and reduced manufacturing costs, making them more efficient and cost-effective for various lighting applications.
Implementation Method 1
metallic plating and/or optical conversion material disposed below portions of an optical element or lens, in addition to incorporating novel LED chips, novel chip-to-chip spacing, and/or novel placement of a reflective material, such as a solder mask within trenches of the package
Implementation Method 2
metallic plating and/or optical conversion material disposed below portions of an optical element or lens
Data Source
AI summary
Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.