LED Package Lead Frame Uplift Housing Design
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Solution Overview
Problem
Conventional LED packages face challenges with low physical strength and vulnerability to moisture, along with non-uniform light emission and increased manufacturing costs due to the half-etching process, which also limits heat dissipation efficiency.
Innovation Solution
The LED package features lead frames with uplift portions surrounded by a housing, including a reinforcing portion that enhances physical strength and prevents moisture absorption, while increasing the heat dissipation area through a design that includes a light-transmitting resin and encapsulation material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the half-etching process is used to form the hole-cup, then the LED package can be manufactured, but the physical strength between lead frames is low and the structure is vulnerable to moisture
Solution Approach 1:
The lead frames are pre-formed with uplift portions before housing injection, creating a structure that inherently provides both mechanical strength and moisture protection. This preliminary structuring of the lead frames enables the housing to be injected directly without requiring post-etching modifications, thus maintaining manufacturing simplicity while significantly improving structural integrity and moisture resistance.
2Ease of manufacture
If the hole-cup is formed by half-etching, then the LED chip can be mounted, but the light emission becomes non-uniform and manufacturing costs increase
Solution Approach 1:
The uplift portions are pre-formed on the lead frames before housing injection, establishing a precise geometric structure that ensures uniform light emission. This preliminary formation eliminates the need for subsequent etching operations that cause non-uniformity, while maintaining manufacturing efficiency through direct housing injection onto the pre-structured lead frames.
3Ease of manufacture
If the conventional direct type heat dissipation structure is used, then the manufacturing is simple, but the heat dissipation area is limited
Solution Approach 1:
The lead frames are extended upward in the vertical dimension to form uplift portions, transforming the conventional planar heat dissipation structure into a three-dimensional configuration. This dimensional extension significantly increases the heat dissipation surface area while maintaining manufacturing simplicity through direct housing injection, as the uplift portions are formed during lead frame fabrication rather than requiring additional processing steps.
Data Source
AI summary
A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.