LED Package Layout With Vertical Stacking for Centered Light Output
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Solution Overview
Problem
Existing light-emitting diode devices face challenges in symmetry and miniaturization due to the placement of the driving chip and light-emitting diode on the same plane, requiring significant substrate space and limiting the use of wire bonding technology, which affects light symmetry and efficiency.
Innovation Solution
A light-emitting diode device design featuring a first and second insulating layer, redistribution layers, and an encapsulating layer, with the light-emitting diode flip-chip bonded to the redistribution layer, allowing for separate placement of the driving chip and diode on different levels and enabling miniaturization without covering the diode, and optionally incorporating a reflective layer for enhanced efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding technology is used to package the driving chip, then electrical connection is achieved, but large substrate space is required which limits the use space of the substrate
Solution Approach 1:
The patent transitions from planar wire bonding to three-dimensional vertical stacking. The light-emitting diode is positioned above the driving chip at different heights, with electrical connections established through vertical conductive structures (vias) through the substrate, thereby eliminating the need for lateral wire bonding space and enabling efficient use of substrate area.
2Ease of manufacture
If the driving chip and light-emitting diode are placed on the same plane, then packaging is simplified, but the light-emitting diode cannot be located at the center affecting light symmetry
Solution Approach 1:
The patent employs vertical stacking to position the light-emitting diode above the driving chip at a different height level. This three-dimensional arrangement allows the light-emitting diode to be precisely positioned at the center of the device while maintaining simplified packaging through direct vertical alignment and bonding, thereby achieving both manufacturing simplicity and optical symmetry.
3Reliability
If the light-emitting diode is covered by substrate structures, then electrical connection is facilitated, but light extraction efficiency is reduced
Solution Approach 1:
The patent segments the substrate into functional regions: an insulating layer for electrical isolation and a transparent encapsulating layer for light extraction. The transparent encapsulating layer is specifically designed to be optically transparent, allowing light to pass through while the insulating layer provides necessary electrical isolation, thereby resolving the conflict between electrical connection and light extraction efficiency.
Data Source
AI summary
A light emitting diode device includes a driving chip, a first insulating layer, a second insulating layer, a first redistribution layer, a second redistribution layer, a plurality of light emitting diodes, and an encapsulating layer. The first insulating layer covers the driving chip. The second insulating layer is disposed under the first insulating layer. The first redistribution layer is disposed on the first insulating layer and electrically connects to the driving chip. The second redistribution layer is disposed between the first insulating layer and the second insulating layer and electrically connected to the first redistribution layer. The plurality of light emitting diodes is bonded to the first redistribution layer. The encapsulating layer covers the first redistribution layer and the plurality of light emitting diodes.