Light Emitting Device Package Void Heat Dissipation
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Solution Overview
Problem
There is a need for light emitting device packages that can be miniaturized to enhance design flexibility while maintaining excellent heat dissipation performance, particularly for high-output applications like general illumination and large LCD backlights, without increasing manufacturing costs.
Innovation Solution
A light emitting device package design featuring a support structure with first and second support electrodes and a connection portion, where the light emitting structure protrudes beyond the support electrodes, creating a void for improved heat dissipation, and includes a lens unit and wavelength conversion layer for enhanced light management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package size is reduced to enable miniaturization, then design flexibility is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent introduces a void space positioned between the light emitting structure and the support structure, creating a three-dimensional heat dissipation pathway. This void allows heat to dissipate vertically rather than only laterally, effectively adding a dimensional aspect to heat management in the compact package design.
Solution Approach 2:
The support structure is designed with a porous or hollow configuration containing a void space. This porous-like structure provides thermal pathways for heat to escape from the light emitting structure, improving heat dissipation performance without increasing the overall package volume.
2Illumination intensity
If the amount of injected current is increased to achieve high-output applications, then luminance is improved, but heat generation increases
Solution Approach 1:
The patent converts the harmful effect of heat generation into a manageable issue by designing a support structure with integrated void spaces that actively channel and dissipate heat. The heat that would normally be a byproduct of high-current operation is now efficiently managed through the structured void pathways, allowing high-output applications to proceed without thermal runaway.
3Temperature
If a larger support structure is used to improve heat dissipation, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent merges the support function and heat dissipation function into a single integrated support structure. The void spaces are incorporated directly into the support structure itself rather than being separate components, thereby improving heat dissipation without increasing device complexity or the number of parts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for a compact micro-package with superior heat dissipation characteristics, enabling efficient thermal management in high-output applications while maintaining design flexibility and reducing manufacturing costs.
Implementation Method 1
a void is present below the protrusion portion and above a plane extending from bottoms of the first and second support electrodes
Data Source
AI summary
A light emitting device package, comprises a light emitting structure having first and second electrodes insulated from each other; and a support structure. The support structure comprises: a first support electrode electrically connected to the first electrode of the light emitting structure; a second support electrode electrically connected to the second electrode of the light emitting structure, the second support electrode spaced apart from, and electrically insulated from, the first support electrode; and a support connection portion between the first support electrode and the second support electrode. The light emitting structure includes a protrusion portion that protrudes in a horizontal direction beyond a sidewall of at least one of the first support electrode and the second support electrode so that a void is present below the protrusion portion and above a plane extending from bottoms of the first and second support electrodes.