LED Package Frame Structure for Void-Free Bonding and Heat Dissipation
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Solution Overview
Problem
Current light emitting device packages face challenges such as void formation between the frame and conductive portions, leading to cracks due to thermal shock, difficulty in soldering small devices, and inefficient heat dissipation, which affects reliability and manufacturing yield.
Innovation Solution
A light emitting device package design featuring first and second frames spaced apart, with a body surrounding them and conductive portions disposed in openings to prevent voids and enhance bonding, improving coupling force and heat dissipation by guiding light and heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging structure is used, then manufacturing process is simple, but voids form between frame and conductive portions causing cracks
Solution Approach 1:
The package structure is segmented into distinct functional regions: a body portion, a first frame extending from the body, and a second frame extending from the body. This segmentation allows each component to be optimized independently for its specific function while maintaining overall structural integrity and preventing void formation.
Solution Approach 2:
The patent introduces a third dimension by extending frames vertically from the body in addition to horizontal spreading. This dimensional transition creates overlapping regions between frames and conductive portions, eliminating voids through multi-layer spatial arrangement rather than planar configuration.
2Productivity
If device size is reduced, then integration density increases, but soldering becomes difficult
Solution Approach 1:
Conductive portions are disposed on the frames before the light emitting device is mounted. This preliminary placement of conductive elements creates pre-formed bonding surfaces that facilitate subsequent soldering processes, even when the final device dimensions are small and integration density is high.
3Loss of energy
If conventional heat dissipation structure is used, then structure is simple, but heat dissipation efficiency is low
Solution Approach 1:
The frames serve multiple functions simultaneously: they provide structural support, establish electrical connections through conductive portions, and act as heat dissipation pathways. This multi-functionality improves heat dissipation efficiency without requiring separate dedicated heat sink components, thus avoiding excessive structural complexity.
4Reliability
If conductive portions are not disposed on bonding portions, then manufacturing is simpler, but voids and cracks occur
Solution Approach 1:
Conductive portions act as intermediary elements positioned between the frames and the light emitting device bonding portions. These intermediaries ensure complete contact and eliminate voids by filling potential gaps, while their strategic placement on bonding portions only requires minimal additional manufacturing steps.
Data Source
AI summary
A light emitting device package according to an embodiment comprises: first and second frames disposed spaced apart from each other; a body disposed surrounding the first and second frames and having first and second openings spaced apart from each other; a light emitting device disposed on the body and including first and second bonding parts; and first and second conductive parts disposed in the first and second openings respectively, wherein the first and second openings perpendicularly overlap the first and second frames respectively, the first and second conductive parts are electrically connected to the first and second frames respectively, the first and second bonding parts are disposed in the first and second openings respectively, and are electrically connected to the first and second conductive parts, and the light emitting device includes a support region disposed on the body outside the first and second openings. In addition, a light source module, according to an embodiment, comprises a circuit board and at least one light emitting device package disposed on the circuit board.