LED Package Component Wavelength Conversion Adhesive
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Solution Overview
Problem
Conventional LED packaged devices suffer from reduced light extraction efficiency due to the difference in refractive indices between the light-emitting chip and the fluorescent adhesive, leading to light loss through total internal reflection.
Innovation Solution
A light-emitting diode package component is designed with a substrate, light-emitting chip, die attach adhesive containing a wavelength conversion material, and a molding layer, where the die attach adhesive converts initial light into excitation light with a longer wavelength, reducing total internal reflection losses by reflecting this light back into the molding layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional fluorescent adhesive with lower refractive index is used, then manufacturing simplicity is maintained, but light extraction efficiency deteriorates due to total internal reflection
Solution Approach 1:
The patent changes the refractive index parameter of the adhesive by incorporating wavelength conversion materials (phosphors) into the die attach adhesive. This modifies the optical properties of the adhesive layer, reducing the refractive index difference between the light-emitting chip and adhesive, thereby minimizing total internal reflection and improving light extraction efficiency while maintaining manufacturing simplicity
Solution Approach 2:
The patent uses composite materials by combining wavelength conversion materials (such as phosphors) with the adhesive matrix to create a functional die attach adhesive. This composite structure enables both mechanical bonding and optical function improvement, solving the light extraction efficiency problem while keeping the manufacturing process conventional
2Loss of energy
If wavelength conversion material is added to die attach adhesive, then light extraction efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into a single component: the die attach adhesive simultaneously performs mechanical bonding (attaching the chip to substrate) and optical wavelength conversion. This consolidation eliminates the need for separate wavelength conversion layers or structures, improving light extraction efficiency without significantly increasing device complexity
Solution Approach 2:
The die attach adhesive is designed with multi-functionality, serving both as an adhesive material for mechanical attachment and as a wavelength conversion medium for optical optimization. This universal component approach resolves the technical contradiction by achieving improved light extraction efficiency through a single integrated material rather than adding separate complex structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light extraction efficiency by minimizing light loss through total internal reflection, resulting in improved luminance and light extraction efficiency, as demonstrated by increased luminance ratios compared to conventional devices.
Implementation Method 1
A portion of the initial light beam that enters into the die attach adhesive excites the first wavelength conversion material to produce an excitation light with a first wavelength. The first wavelength is greater than the initial wavelength.
Implementation Method 2
when a light beam generated by the light-emitting chip emits from the light-emitting chip and enters into the fluorescent adhesive, a portion of the light beam may be totally reflected and then be lost
Data Source
AI summary
A light-emitting diode package component is provided. The light-emitting diode package component includes a substrate, a light-emitting chip, a die attach adhesive, a reflective structure, and a molding layer. The light-emitting chip is disposed on the substrate for generating an initial light beam with an initial wavelength. The die attach adhesive is disposed between the light-emitting chip and the substrate so that the light-emitting chip is mounted on the substrate. The reflective structure defining an accommodating space is disposed on the substrate and surrounds the light-emitting chip. The molding layer is disposed in the accommodating space and covers the light-emitting chip. The die attach adhesive includes a first wavelength conversion material, a portion of the initial light beam entering into the die attach adhesive excites the first wavelength conversion material to produce an excitation light with a first wavelength that is greater than the initial wavelength.