LED Package Wire Placement in Phosphor Layer
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Solution Overview
Problem
Existing light emitting device packages face issues with wire bonding defects and efficiency drooping due to the placement of wires within resin layers, leading to non-uniform color-coordinate distribution and reduced brightness in white LEDs.
Innovation Solution
A light emitting device package design where a wire is disposed within a phosphor layer within a cavity, electrically connecting the light emitting device to lead electrodes, reducing the likelihood of wire bonding defects and enhancing light efficiency by minimizing phosphor layer ascension along the wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are placed within resin layers for electrical connection, then electrical connectivity is achieved, but wire bonding defects occur and manufacturing precision deteriorates
Solution Approach 1:
The patent extracts the wires from the resin layer and relocates them to the phosphor layer. Specifically, wires are positioned within the phosphor layer before encapsulation, allowing electrical connection while preventing the wires from being embedded in resin where they cause bonding defects and color non-uniformity. This spatial extraction resolves the contradiction by separating the wire placement location from the problematic resin layer.
Solution Approach 2:
The phosphor layer serves as an intermediary medium that facilitates both electrical connection and light emission. By placing wires within the phosphor layer rather than the resin layer, the patent uses the phosphor layer as a mediator that allows wire placement without causing the harmful effects observed in resin layers, thereby improving both reliability and manufacturing precision.
2Use of energy by moving object
If phosphor layer is applied over wires for light emission, then light efficiency is improved, but phosphor layer ascension along wires occurs causing color non-uniformity
Solution Approach 1:
The patent applies preliminary action by positioning the wires within the phosphor layer before the encapsulation process. The wires are strategically placed and secured in the phosphor layer prior to final encapsulation, preventing subsequent phosphor layer ascension along the wires. This advance positioning ensures uniform color distribution while maintaining light emission efficiency.
Solution Approach 2:
The patent implements preliminary anti-action by taking measures to prevent phosphor layer ascension before it can occur. By securing wires properly within the phosphor layer and controlling the encapsulation process, the patent preemptively counteracts the tendency of phosphor material to climb along wire surfaces, thereby maintaining color-coordinate uniformity.
3Reliability
If lead electrodes are enclosed within package body for protection, then device protection is improved, but heat radiation capability deteriorates
Solution Approach 1:
The patent applies local quality by differentiating the treatment of different parts of the lead electrodes. While portions of the lead electrodes are enclosed within the package body for protection, other portions are intentionally exposed at the bottom surface to facilitate heat radiation. This localized differentiation allows simultaneous achievement of device protection and effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves color-coordinate distribution, brightness, and manufacturing yield by preventing wire bonding defects and optimizing light reflection, while effectively radiating heat through exposed lead electrodes.
Implementation Method 1
Group III-V nitride semiconductors have been in the spotlight as a core material for light emitting devices, such as light emitting diodes (LEDs)
Implementation Method 2
LEDs are a kind of semiconductor device that converts electricity into infrared rays or light
Implementation Method 3
a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode
Data Source
AI summary
A light emitting device package is provided. The light emitting device package includes a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.