Light-emitting device package flexible wiring configurations
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Solution Overview
Problem
Conventional light-emitting device packages face difficulties in diversifying circuit wiring structures due to fixed upper pad designs, making it troublesome to change the wiring configuration of multiple light-emitting device chips.
Innovation Solution
A light-emitting device package with a body and upper pads where multiple light-emitting device chips are connected using various wiring structures, including serial and parallel connections, allowing for flexible wiring configurations while maintaining fixed upper pad shapes and sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the upper pad design is fixed, then the manufacturing process is simplified, but the circuit wiring structure cannot be diversified
Solution Approach 1:
The patent segments the wiring function from the pad structure by introducing separate wire elements that can be configured in different patterns (serial, parallel, or combination) while the upper pads remain fixed in design. This allows multiple wiring structures to be achieved without changing the pad layout, resolving the contradiction between manufacturing simplicity and wiring versatility.
2Adaptability or versatility
If multiple wiring structures are implemented, then the circuit configuration flexibility is improved, but the design complexity increases
Solution Approach 1:
The patent creates a universal wiring system where the same fixed upper pad design can support multiple circuit configurations (serial connection, parallel connection, or mixed) by varying only the wire routing patterns. This multi-functional approach allows a single pad design to serve multiple wiring purposes, reducing overall design complexity while maintaining configuration flexibility.
Data Source
AI summary
A light-emitting device package according to an embodiment may include a body; N (herein, N denotes a positive integer of 5 or more) upper pads disposed on the body to be spaced apart from each other; N−1 light-emitting device chips respectively arranged on N−1 upper pads among the N upper pads; and a plurality of first wires for electrically connecting the N−1 light-emitting device chips and the N upper pads to each other by at least one of a plurality of wiring structures.