Light Emitting Package Direct Wiring for Thermal Management
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Solution Overview
Problem
Conventional light emitting element packages face limitations in size reduction and heat dissipation, which restricts design freedom and increases production costs due to their premolded structure and mounting on circuit boards.
Innovation Solution
A light emitting element package with a laminated semiconductor structure, a terminal unit, a molded unit with a filler, and a wavelength conversion unit, where the package is mounted directly on a wiring pattern to simplify heat transmission and reduce size, using materials like SiO2, TiO2, and Al2O3, and including reflective and external electrodes for enhanced light emission and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a premolded structure or conventional package structure is used, then the light emitting element package can be manufactured with standard processes, but the size of the package cannot be reduced, limiting design freedom
Solution Approach 1:
The package structure is divided into separate functional components: a light emitting element, a wavelength conversion unit, and a molded unit. This segmentation allows each component to be optimized independently and assembled in flexible configurations, enabling ultra-small package sizes while maintaining design freedom for various illumination applications
Solution Approach 2:
The wavelength conversion unit is disposed within or integrated with the molded unit structure, and the light emitting element is positioned within the package cavity. This nested arrangement maximizes space utilization, allowing multiple functional elements to coexist in a compact volume,从而实现 ultra-small package size
2Temperature
If heat is dissipated through the circuit board, then the light emitting element package can be mounted on standard substrates, but the heat dissipation efficiency is reduced, degrading reliability
Solution Approach 1:
The heat dissipation function is extracted from the circuit board mounting path and integrated directly into the package structure through the molded unit and wiring pattern configuration. This allows heat to be dissipated through a dedicated thermal path from the light emitting element through the wiring pattern, improving heat dissipation efficiency and reliability without depending on the circuit board
Solution Approach 2:
The molded unit serves as an intermediary structure that provides both mechanical support and thermal management. It contains the light emitting element and facilitates direct heat transfer to the wiring pattern, acting as a thermal interface that improves heat dissipation efficiency while maintaining package integrity
3Volume of moving object
If the package structure is simplified to reduce size, then design freedom is enhanced, but the manufacturing complexity increases
Solution Approach 1:
The wavelength conversion unit and molded unit are prepared and positioned in advance during the packaging process. The light emitting element is pre-mounted on the wiring pattern before final encapsulation. These preliminary actions simplify the overall manufacturing process by reducing the number of subsequent assembly steps, making the ultra-small package structure easier to manufacture despite its compact design
Solution Approach 2:
Multiple functions are merged into single components: the molded unit simultaneously provides structural support, encapsulation, and thermal management; the wiring pattern serves both electrical connection and heat dissipation functions. This functional merging reduces the number of separate components needed, simplifying the manufacturing process while maintaining the ultra-small package size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables an ultra-small package design with improved heat dissipation and reduced production costs, allowing for greater design flexibility and efficient light emission by directly mounting the package on a wiring pattern, thus enhancing both thermal management and manufacturing efficiency.
Implementation Method 1
a wavelength conversion unit disposed on the first main surface of the light emitting laminate
Implementation Method 2
The molded unit may include a filler and a white molding compound. The filler may have one or more materials selected from the group consisting of SiO2, TiO2, and Al2O3
Implementation Method 3
A light emitting diode (LED) is a type of a luminous element (or light emitting element) capable of implementing light in various colors by forming a light emission source through a PN junction in a compound semiconductor
Data Source
AI summary
There is provided a light emitting element package including: a light emitting laminate having a structure in which semiconductor layers are laminated and having a first main surface and a second main surface opposing the first main surface; a terminal unit disposed on an electrode disposed on the second main surface; a molded unit disposed on the second main surface of the light emitting laminate and allowing a portion of the terminal unit to be exposed; and a wavelength conversion unit disposed on the first main surface of the light emitting laminate.