Substrate-Free LED Packaging With Light-Absorbing Encapsulation
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Solution Overview
Problem
The existing LED packaging technologies face challenges in achieving thinness and integration due to the thickness of RGB LEDs, which limits their application in display screens, and result in inconsistent light color and reduced display quality due to packaging thickness and material selection issues.
Innovation Solution
A light-emitting diode (LED) packaging module comprising LED chips with a wiring layer and an encapsulant component, where the LED chips are spaced apart, and the encapsulant component covers the chip side surfaces and wiring layer, with a light-absorbing material to reduce optical crosstalk and enhance contrast, eliminating the need for substrates and solder paste, thereby reducing packaging thickness and improving display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If traditional substrate-based LED packaging is used, then structural support and electrical connection are ensured, but packaging thickness becomes greater than 500 μm which limits thinness and integration
Solution Approach 1:
The patent extracts and removes the substrate from the traditional LED packaging structure. By directly mounting LED chips onto the packaging housing without a substrate, the design eliminates the substrate layer and associated wire bonding processes, thereby reducing packaging thickness while maintaining structural support and electrical connection functions through alternative means.
Solution Approach 2:
The patent merges the packaging housing with the mounting and electrical connection functions. The housing structure is designed to directly hold the LED chips and provide electrical pathways, combining previously separate functions (structural support, mounting, and electrical connection) into a single integrated component, thus reducing overall thickness.
2Length of stationary object
If solder paste or wire bonding is used for chip connection, then electrical connection is achieved, but packaging thickness increases and manufacturing complexity rises
Solution Approach 1:
The patent extracts and eliminates solder paste and wire bonding from the manufacturing process. By采用 direct mounting methods where LED chips are mechanically and electrically connected to the housing without intermediate bonding materials, the design reduces packaging thickness and simplifies manufacturing while maintaining reliable electrical connections.
3Reliability
If thick encapsulant material is used to cover LED chips, then chip protection and light extraction are improved, but packaging thickness increases
Solution Approach 1:
The patent changes the parameters of the encapsulant material, using a thin layer that provides sufficient protection and light extraction functionality without adding excessive thickness. The encapsulant is applied as a thin coating that maintains chip protection and optical performance while minimizing contribution to overall packaging thickness.
4Ease of manufacture
If conventional packaging materials are used, then manufacturing is simplified, but light color consistency deteriorates due to optical crosstalk
Solution Approach 1:
The patent converts the potential harm of optical crosstalk into a benefit by using light-absorbing material in the encapsulant. This material absorbs stray light that would otherwise cause color inconsistency, transforming the problematic optical interference into a mechanism that enhances color uniformity across the display while maintaining ease of manufacturing.
Solution Approach 2:
The patent uses composite encapsulant material that combines protective and optical properties. The encapsulant includes light-absorbing components that prevent optical crosstalk while maintaining the protective and light extraction functions, achieving both manufacturing simplicity and high light color consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a thinner and more integrated LED packaging module with improved contrast and display quality by reducing optical crosstalk and eliminating the need for substrates and solder paste, allowing for smaller pixel pitch and higher resolution in display devices.
Implementation Method 1
The encapsulant component includes a first encapsulating layer covering the chip side surface and the chip first surface of each of the LED chips, and a second encapsulating layer covering the side wiring layer surface of the wiring layer and filling gaps among the wiring parts
Data Source
AI summary
A LED packaging module includes a plurality of LED chips, a wiring layer, and an encapsulant component. The LED chips are spaced apart, each of which includes chip first, chip second, and chip side surfaces, and an electrode unit. The wiring layer is disposed on the chip second surfaces, has first, second, and side wiring layer surfaces, and is divided into a plurality of wiring parts spaced apart. The first wiring layer surface contacts and is electrically connected to the electrode units. The encapsulant component includes first and second encapsulating layers, covers the chip side surfaces, the chip first surfaces, and the side wiring layer surface, and fills gaps among the wiring parts. Each LED chip has a thickness represented by TA, the first encapsulating layer has a thickness represented by TB, and TA and TB satisfy a relationship: TB/TA≥1.