LED Packaging Module With Light-Transmitting Layer for Low Crosstalk
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Solution Overview
Problem
Current LED packaging technologies face challenges in achieving smaller LED package sizes while maintaining effective light emission and reducing optical crosstalk.
Innovation Solution
The proposed LED packaging module incorporates a plurality of LED chips with a colored encapsulating layer, a light-transmitting layer, and a wiring assembly. The encapsulating layer covers the side surfaces of the LED chips, fills the spaces between them, and exposes the electrodes and a portion of the light-exiting surfaces. The light-transmitting layer covers the light-exiting surfaces for protection and to reduce optical interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If LED package size is reduced to increase display resolution, then display resolution is improved, but optical crosstalk between adjacent LEDs increases
Solution Approach 1:
A reflective layer is introduced as an intermediary component between adjacent LED packages. This reflective layer redirects stray light that would otherwise cause optical crosstalk back toward the light-exiting surface, thereby reducing interference between adjacent LEDs while maintaining small package sizes for high display resolution
Solution Approach 2:
The reflective layer is designed with specific optical properties to reflect certain wavelengths while allowing others to pass through. By optimizing the reflective characteristics of this layer, the patent minimizes optical crosstalk in the visible spectrum while maintaining efficient light extraction from the LED chips
2Measurement precision
If LED package size is reduced, then display resolution is improved, but light emission efficiency decreases
Solution Approach 1:
The patent utilizes the side surfaces of the LED chips in addition to the top surface for light extraction. By designing the LED chip structure to emit light from multiple surfaces (top and sides), the effective light extraction area is increased within the constrained package footprint, maintaining light emission efficiency while enabling smaller package sizes for higher display resolution
Solution Approach 2:
The reflective layer serves as a mediator that redirects light trapped within the package or emitted at oblique angles back toward the light-exiting surfaces. This increases the probability of light extraction and reduces re-absorption, thereby maintaining light emission efficiency in compact package designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a smaller LED package size, improved light concentration on the light-exiting surfaces, reduced optical crosstalk, and enhanced display panel resolution.
Implementation Method 1
The light-transmitting layer is disposed on the encapsulating layer, covers the chip first surfaces of the LED chips exposed from the encapsulating layer, and has a light transmittance greater than that of the encapsulating layer
Implementation Method 2
The encapsulating layer is a colored layer
Data Source
AI summary
A light-emitting diode (LED) packaging module includes a plurality of LED chips spaced apart from one another, an encapsulating layer that fills in a space among the LED chips, a light-transmitting layer disposed on the encapsulating layer, a wiring assembly disposed on and electrically connected to the LED chips, and an insulation component that covers the encapsulating layer and the wiring assembly. Each of the LED chips includes an electrode assembly including first and second electrodes. The light-transmitting layer includes a light-transmitting layer that has a light transmittance greater than that of the encapsulating layer.