LED Packaging Structure With Metal Shielding for Driver Chip Interference
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Solution Overview
Problem
Existing LED packaging structures suffer from signal interference issues due to the susceptibility of the driver chip, which affects the normal usability and reliability of the LED packaging unit.
Innovation Solution
A packaging structure is designed with a metal bracket, driver chip, light-emitting component, and a metal cover plate, where the driver chip is enclosed by the metal bracket and cover plate, surrounded by pins, and fixed with colloid cured layers, enhancing signal shielding and reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the driver chip and light-emitting component are disposed on opposite sides of the metal bracket in a vertical packaging structure, then the size of the LED packaging unit is reduced, but the driver chip becomes susceptible to external signal interference and causes signal interference to other components
Solution Approach 1:
A metal cover plate is introduced as an intermediary shielding component between the driver chip and external environment. The cover plate is connected to the metal bracket through grounding, creating a Faraday cage effect that blocks external electromagnetic signals from reaching the driver chip while allowing the compact vertical structure to be maintained
Solution Approach 2:
The metal cover plate and metal bracket form a shielded enclosure around the driver chip, creating an electromagnetic inert environment. This enclosure is grounded to earth potential, isolating the driver chip from external electromagnetic interference and preventing it from radiating signals to other components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved packaging structure enhances signal shielding, improving the use stability and reliability of the LED packaging unit by reducing signal interference and enhancing structural integrity.
Implementation Method 1
The metal bracket, the pins and the metal cover plate are respectively disposed on different sides of the driver chip, so that the six sides of the driver chip are surrounded by metal
Data Source
AI summary
A packaging structure, which includes a metal bracket, a driver chip, a light-emitting component, a packaging member and a metal cover plate. The metal bracket includes a plurality of pins, and first and second surfaces oppositely disposed. The driver chip is disposed on the first surface, and configured to control a light-emitting state of the light-emitting component. The light-emitting component is disposed on the second surface and electrically connected to the driver chip through the metal bracket. The packaging structure is disposed on the metal bracket, and configured to fix the metal bracket and enclose the driver chip and the light-emitting component. The pins are disposed surrounding the driver chip and are partially exposed from the packaging member. The metal cover plate is disposed on a side of the driver chip away from the light-emitting component, covering an entire surface of the driver chip.