LED Packaging Thermal Dissipation and Mechanical Strength

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Solution Overview

Problem

Traditional LED packaging structures suffer from weak mechanical strength and inefficient heat dissipation, leading to physical failures and reduced light output uniformity and lifespan.

Innovation Solution

A lighting apparatus featuring a thermally-conductive substrate with a silicon or ceramic substrate, a printed circuit board, and a heat sink, where the LED dies are thermally coupled to the substrate through a thermally conductive but electrically insulating layer, and electrically coupled to the PCB, enhancing mechanical strength and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If traditional LED packaging structures are used, then device simplicity is maintained, but heat dissipation efficiency deteriorates and mechanical strength becomes weak

Engineering Contradiction:

Improvemechanical strengthVSAvoidpackaging structure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The packaging structure is divided into distinct functional modules: a substrate for mechanical support, a thermal dissipation structure for heat management, and a printed circuit board for electrical connections. This segmentation allows each component to be optimized independently while working together to solve both mechanical strength and heat dissipation requirements.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate and thermal dissipation structure are merged into an integrated assembly where the substrate serves dual purposes: providing mechanical support and facilitating heat dissipation. This merging resolves the contradiction by combining structural and thermal management functions into a unified component system.

Inventive Principle:

Principle #5Merging (Combining)

2Loss of energy

If traditional LED packaging structures are used, then manufacturing simplicity is maintained, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing simplicity

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

A thermal interface material or conductive adhesive is introduced as an intermediary between the substrate and thermal dissipation structure to enhance heat transfer efficiency. This intermediary layer improves thermal coupling while maintaining manufacturing feasibility through standard assembly processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal conductivity parameter of the packaging structure is enhanced by selecting materials with higher thermal conductivity for the substrate and thermal dissipation structure. This parameter change improves heat dissipation efficiency while remaining compatible with existing manufacturing capabilities.

Inventive Principle:

Principle #35Parameter changes

3Loss of energy

If traditional LED packaging structures are used, then structural simplicity is maintained, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructural simplicity

Core Design Contradiction:

Loss of energyVSStability of the object's composition

Solution Approach 1:

The packaging structure employs composite materials combining substrates with thermal dissipation structures made from materials having different properties (e.g., high thermal conductivity with appropriate mechanical characteristics). This composite approach improves heat dissipation while maintaining structural integrity and simplicity.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves light output uniformity and heat dissipation, increasing the mechanical durability and lifespan of LED devices while eliminating the need for expensive Metal Core Printed Circuit Boards and Through-Silicon-Vias, reducing fabrication costs and complexity.

Implementation Method 1

a thermally-conductive substrate... a thermal dissipation structure thermally coupled to the thermally-conductive substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The photonic device is thermally coupled to the thermally-conductive substrate through a thermally conductive but electrically insulating layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8783911B2LED packaging structure having improved thermal dissipation and mechanical strength

Publication Date: 2014.07.22 ENNOSTAR CORP

AI summary

The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.