LED Packaging with Transparent Cover and Heat Sink

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Solution Overview

Problem

Conventional LED packaging designs face inefficiencies in light extraction and heat management, leading to reduced light output and performance, particularly when closely packing multiple LEDs to increase brightness and reliability.

Innovation Solution

The design incorporates a multi-layer stack with a package that includes a layer configured to allow at least 75% of emitted light to pass through, with a transparent cover positioned close to the LED to minimize absorption and enhance optical component integration, and a heat sink layer for thermal management, allowing for efficient light transmission and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional LED packaging designs are used, then the structure is simple and easy to manufacture, but light extraction efficiency is poor and heat management is inadequate

Engineering Contradiction:
Improvepackaging structure simplicityVSAvoidlight extraction efficiency
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The packaging structure is divided into multiple functional layers including a transparent cover layer, intermediate layers, and a heat sink layer. This segmentation allows each layer to perform its specific function optimally - the transparent cover maximizes light transmission, while the heat sink manages thermal dissipation, thereby resolving the contradiction between manufacturing simplicity and light extraction efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The packaging employs composite material structures with different optical and thermal properties. The transparent cover layer uses materials with high light transmission characteristics, while the heat sink layer uses materials with high thermal conductivity. This composite approach enables simultaneous optimization of light extraction and heat management without compromising manufacturing feasibility.

Inventive Principle:
Principle #40Composite materials

2Illumination intensity

If multiple LEDs are closely packed to increase brightness and reliability, then light output increases, but light absorption between adjacent LEDs increases and heat management becomes more difficult

Engineering Contradiction:
Improvelight outputVSAvoidlight absorption
Core Design Contradiction:
Illumination intensityVSLoss of energy

Solution Approach 1:

The transparent cover layer acts as an intermediary optical element that facilitates light extraction from multiple closely-packed LEDs. Its high transmission property minimizes light absorption between adjacent LEDs, allowing increased LED density for higher light output while reducing parasitic light absorption that would otherwise occur in conventional packaging.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Loss of energy

If a transparent cover is positioned close to the LED, then light transmission is maximized and optical component integration is enhanced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvelight absorptionVSAvoidcover positioning accuracy
Core Design Contradiction:
Loss of energyVSManufacturing precision

Solution Approach 1:

The packaging structure is designed with pre-formed features and alignment mechanisms that enable the transparent cover to be positioned at the optimal distance from the LED during the packaging process. This preliminary design of alignment features reduces the actual manufacturing precision requirements during assembly, allowing the cover to be positioned close to the LED for maximum light transmission without excessively tight tolerances.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly increases light output and reliability by reducing light absorption and enhancing heat dissipation, enabling closer packing of LEDs without performance degradation, thus improving the efficiency and effectiveness of LED arrays in various applications.

Implementation Method 1

a layer configured so that at least about 75% of the light that that emerges from the light emitting device and impinges on the layer passes through the layer

Methodology Applied
Scientific EffectLight transmission: Absorption (EM radiation)

Implementation Method 2

a heat sink layer for thermal management, allowing for efficient light transmission and heat dissipation

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS7692207B2Packaging designs for LEDs
Publication Date: 2010.04.06 LUMINUS DEVICES INC
  • US7692207B2 patent drawing
  • US7692207B2 patent drawing
  • US7692207B2 patent drawing

AI summary

Light-emitting devices, and related components, processes, systems and methods are disclosed.