LED Packaging with Transparent Cover and Heat Sink
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Solution Overview
Problem
Conventional LED packaging designs face inefficiencies in light extraction and heat management, leading to reduced light output and performance, particularly when closely packing multiple LEDs to increase brightness and reliability.
Innovation Solution
The design incorporates a multi-layer stack with a package that includes a layer configured to allow at least 75% of emitted light to pass through, with a transparent cover positioned close to the LED to minimize absorption and enhance optical component integration, and a heat sink layer for thermal management, allowing for efficient light transmission and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional LED packaging designs are used, then the structure is simple and easy to manufacture, but light extraction efficiency is poor and heat management is inadequate
Solution Approach 1:
The packaging structure is divided into multiple functional layers including a transparent cover layer, intermediate layers, and a heat sink layer. This segmentation allows each layer to perform its specific function optimally - the transparent cover maximizes light transmission, while the heat sink manages thermal dissipation, thereby resolving the contradiction between manufacturing simplicity and light extraction efficiency.
Solution Approach 2:
The packaging employs composite material structures with different optical and thermal properties. The transparent cover layer uses materials with high light transmission characteristics, while the heat sink layer uses materials with high thermal conductivity. This composite approach enables simultaneous optimization of light extraction and heat management without compromising manufacturing feasibility.
2Illumination intensity
If multiple LEDs are closely packed to increase brightness and reliability, then light output increases, but light absorption between adjacent LEDs increases and heat management becomes more difficult
Solution Approach 1:
The transparent cover layer acts as an intermediary optical element that facilitates light extraction from multiple closely-packed LEDs. Its high transmission property minimizes light absorption between adjacent LEDs, allowing increased LED density for higher light output while reducing parasitic light absorption that would otherwise occur in conventional packaging.
3Loss of energy
If a transparent cover is positioned close to the LED, then light transmission is maximized and optical component integration is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The packaging structure is designed with pre-formed features and alignment mechanisms that enable the transparent cover to be positioned at the optimal distance from the LED during the packaging process. This preliminary design of alignment features reduces the actual manufacturing precision requirements during assembly, allowing the cover to be positioned close to the LED for maximum light transmission without excessively tight tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases light output and reliability by reducing light absorption and enhancing heat dissipation, enabling closer packing of LEDs without performance degradation, thus improving the efficiency and effectiveness of LED arrays in various applications.
Implementation Method 1
a layer configured so that at least about 75% of the light that that emerges from the light emitting device and impinges on the layer passes through the layer
Implementation Method 2
a heat sink layer for thermal management, allowing for efficient light transmission and heat dissipation
Data Source
AI summary
Light-emitting devices, and related components, processes, systems and methods are disclosed.


