LED Module Pad Array Layout for Flexible Circuit Topologies
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Solution Overview
Problem
Conventional light emitting diode packages face limitations in circuit configuration flexibility and space utilization due to predetermined connections, leading to design difficulties and inefficient space usage.
Innovation Solution
A light emitting apparatus with an electrodeless pad array that allows for flexible circuit configurations, including series, parallel, or series-parallel connections, by using a base substrate with pads and an electrodeless pad array that can be arranged in specific patterns to optimize space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If predetermined circuit connections are used in conventional LED packages, then manufacturing is simplified, but circuit configuration flexibility is limited
Solution Approach 1:
The invention divides the circuit connection function into separate elements: individual LED chips with their own pads, and a separate electrodeless pad array on the substrate. This segmentation allows flexible configuration of circuit connections (series, parallel, or series-parallel) by selectively connecting pads during assembly, while each LED chip can be manufactured independently using conventional methods.
Solution Approach 2:
The invention moves the circuit configuration flexibility from the manufacturing dimension to the assembly dimension. By placing multiple pads on each LED chip and creating an electrodeless pad array on the substrate, the patent enables circuit topology to be determined during assembly rather than being fixed during manufacturing, thus resolving the contradiction between manufacturing simplicity and configuration flexibility.
2Adaptability or versatility
If external circuitry is used for series, parallel or series-parallel connections, then circuit configuration flexibility is improved, but space utilization becomes inefficient
Solution Approach 1:
The invention merges the circuit connection function with the substrate structure by integrating the electrodeless pad array directly onto the package substrate. This eliminates the need for separate external circuit boards or trace routing, allowing circuit connections to be made within the compact package footprint and improving space utilization while maintaining configuration flexibility.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the LED chips, contains the electrodeless pad array for electrical connections, and acts as the final package structure. This multi-functionality eliminates the need for separate external circuitry, achieving both space efficiency and circuit configuration flexibility.
3Adaptability or versatility
If stacked circuit board is applied for circuit connections, then circuit configuration flexibility is improved, but design difficulty increases
Solution Approach 1:
The invention extracts the circuit connection function from complex stacked circuit board designs and implements it directly on the package substrate through the electrodeless pad array. This simplifies the overall design by eliminating the need for separate PCB layers and complex trace routing, reducing design difficulty while maintaining the ability to configure series, parallel, or series-parallel connections.
Data Source
AI summary
A light emitting apparatus is disclosed. The light emitting apparatus includes: a base substrate; a plurality of circuits disposed on an upper side of the base substrate; a light emitting source included in at least one circuit among the plurality of circuits; a first pad and a second pad disposed on a lower side of the base substrate and contacting one electrode or another electrode of each of the plurality of circuits; and an electrodeless pad array disposed on the lower side of the base substrate. The number of electrodeless pads included in the electrodeless pad array is determined based on a number of the plurality of circuits.