LED Chip Pad Layout With Cross-Groove for Luminous Efficiency
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current LED light sources face reduced luminous efficiency due to optical interference and inconsistent heat generation from LED chips of different sizes and electrode pads, leading to reliability issues.
Innovation Solution
A light-emitting diode (LED) light source with a special cross-groove structure where the first LED chip protrudes from the positive electrode pad to cover part of the groove between pads, allowing consistent heat generation and even distribution of LED chips, enhancing stability and luminous efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If LED chips are disposed on the negative electrode pad only, then the structure is simple, but severe optical interference occurs and luminous efficiency is reduced
Solution Approach 1:
The patent divides the LED chip arrangement into two segments: one LED chip disposed on the negative electrode pad and another LED chip disposed on the positive electrode pad. This segmentation eliminates optical interference by separating the light sources onto different electrode pads, thereby improving luminous efficiency while maintaining structural simplicity through symmetrical distribution.
2Area of stationary object
If LED chips of different sizes are disposed on different electrode pads, then space utilization is improved, but heat generation becomes inconsistent and reliability is reduced
Solution Approach 1:
The patent applies local quality by disposing LED chips of different sizes on different electrode pads according to their specific current requirements. The larger LED chip with higher current is placed on the negative electrode pad, while the smaller LED chip with lower current is placed on the positive electrode pad. This localized arrangement ensures that each LED chip operates within its optimal parameters, maintaining heat generation consistency and reliability while effectively utilizing substrate space.
3Reliability
If the first LED chip protrudes from the positive electrode pad to cover the groove, then heat generation consistency is improved, but device complexity increases
Solution Approach 1:
The patent merges the first LED chip with the groove structure by allowing the LED chip to protrude from the positive electrode pad and cover the groove between the electrode pads. This merging approach ensures consistent heat generation and improved thermal management while maintaining a compact overall structure. The groove design integrates the heat dissipation function into the existing electrode pad structure, minimizing additional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cross-groove structure ensures consistent heat generation and reduced optical interference, improving the reliability and luminous efficiency of the LED light source without increasing costs, making it more comprehensive in application.
Implementation Method 1
these LED chips are all disposed on the negative electrode pad of the substrate of the LED light source, which may result in severe optical interference
Implementation Method 2
as the currents flowing through these two LED chips are different, the voltages of these LED chips are also different. Consequently, the heat generation of these two LED chips will be inconsistent
Data Source
AI summary
A light-emitting diode (LED) light source having high luminous efficiency includes a substrate, a positive electrode pad, a negative electrode pad, a first LED chip and a second LED chip. The positive electrode pad is disposed on the substrate. The negative electrode pad is disposed on the substrate, and there is a groove formed between the negative electrode pad and the positive electrode pad. The first LED chip is disposed on the positive electrode pad, and electrically connected to the positive electrode pad and negative electrode pad. The second LED chip is disposed on the negative electrode pad, and electrically connected to the positive electrode pad and negative electrode pad. A portion of the first LED chip protrudes from the positive electrode pad and covers a portion of the groove.