Light Emitting Display Pad Terminal Exposure via Wet Etching
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Solution Overview
Problem
The existing manufacturing processes for light emitting displays require additional masks and complex patterning processes to expose terminals, increasing equipment complexity and decreasing productivity.
Innovation Solution
A method for manufacturing light emitting displays that involves forming thin film transistors and electroluminescent devices, applying a protection layer, and using wet etching with BOE to remove the protection layer on the pad part, eliminating the need for additional masks and simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If additional masks and patterning processes are used to expose terminals, then the terminal exposure is achieved, but the equipment complexity increases and productivity decreases
Solution Approach 1:
The invention extracts the terminal exposure function from the complex mask-based patterning process. By forming the protection layer to directly cover the terminal region without requiring additional masks, the essential function of terminal exposure is achieved through a simplified process that eliminates unnecessary equipment and steps.
Solution Approach 2:
The protection layer is formed in advance during the OLED manufacturing process, before the sealing step. This preliminary formation of the protection layer with integrated terminal coverage eliminates the need for subsequent mask-based exposure processes, simplifying the overall manufacturing sequence.
2Manufacturing precision
If additional masks and patterning processes are used to expose terminals, then the terminal exposure is achieved, but the number of processes increases
Solution Approach 1:
The invention merges the terminal exposure function with the OLED structure formation process. The protection layer is formed as an integral part of the OLED manufacturing sequence, combining multiple functions (protection and terminal coverage) into a single process step rather than requiring separate mask and patterning operations.
Solution Approach 2:
The protection layer is formed in advance during the OLED manufacturing process, before the sealing step. This preliminary formation of the protection layer with integrated terminal coverage eliminates the need for subsequent mask-based exposure processes, simplifying the overall manufacturing sequence.
3Manufacturing precision
If mask is used to expose the electrode, then the terminal exposure is achieved, but additional processes for providing the mask must be performed
Solution Approach 1:
The invention extracts the terminal exposure function from the mask-based patterning process. By forming the protection layer to directly cover the terminal region without requiring additional masks, the essential function of terminal exposure is achieved through a simplified process that eliminates unnecessary equipment and steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of manufacturing processes, simplifies equipment setup, and enhances productivity by allowing deeper etching of the protection layer without additional mask-related complexities.
Implementation Method 1
During the removing of the protection layer, the etching process is wet etching
Data Source
AI summary
A method of manufacturing a light emitting display including an image display part formed on a substrate and a pad part including at least one terminal electrically connected to the image display part. The method includes forming thin film transistors and at least one electroluminescent device electrically connected to the thin film transistors and including a first electrode layer, an emission layer, and a second electrode layer on the image display part, forming a protection layer on the second electrode layer of the electroluminescent device and the pad part, sealing the image display part on the protection layer, and removing the protection layer formed at least on the pad part to expose the terminals. Therefore, it is possible to easily remove the protection layer formed of organic material or inorganic material formed on the pad part without an additional mask.