LED Panel Circuit Board Pad Layout for Dense Pixel Repair
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Solution Overview
Problem
Existing light-emitting diode (LED) transfer technologies result in faulty pixels and low yield rates due to errors during transposition, and the conventional electrode pad arrangement on circuit boards is not suitable for high pixel density applications, leading to area inefficiency and contamination issues during mass transfers.
Innovation Solution
A circuit board design with electrode pad groups arranged in a specific configuration, allowing for higher pixel density and protected substitute electrode pads during mass transfers, where the substitute pads are only exposed during repair, preventing contamination and improving repair success rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electrode pads for repair are disposed on the sides of the two electrode pads where the LED is connected, then repair functionality is provided, but the area utilization of the circuit board decreases
Solution Approach 1:
The patent introduces a third electrode pad arranged in a direction different from the first two electrode pads. Instead of placing repair pads on the sides (linear arrangement), the third pad extends in another dimension, creating a two-dimensional electrode pad group layout that optimizes space utilization while maintaining repair capability.
2Ease of repair
If electrode pads for repair are exposed during mass transfers, then repair functionality is accessible, but contamination may arise and bonding after repair is adversely affected
Solution Approach 1:
The patent applies an insulating layer over the third electrode pad before the mass transfer process. This preliminary protective action prevents contamination during LED transfer operations. The insulating layer is subsequently removed only when repair is needed, ensuring the pad remains protected until the moment of use.
Solution Approach 2:
The insulating layer is selectively removed from the third electrode pad area after the mass transfer process is complete. This extraction of the protective layer only when and where needed allows the pad to be accessible for repair while remaining protected during the critical mass transfer phase.
3Device complexity
If conventional electrode pad arrangement is used, then simple structure is maintained, but it is not suitable for high pixel density applications
Solution Approach 1:
The patent transitions from a simple linear arrangement of electrode pads to a two-dimensional electrode pad group configuration. By adding the third electrode pad in a different direction and arranging multiple pads in groups, the design achieves higher pixel density while maintaining reasonable structural complexity.
Solution Approach 2:
The electrode pads are segmented into groups, where each group contains multiple electrode pads (first, second, and third pads) arranged in specific configurations. This segmentation allows for optimized space utilization and higher pixel density while maintaining clear functional organization.
Data Source
AI summary
A circuit board includes a plurality of pixel areas. Each pixel area includes a plurality of electrode pad groups. The electrode pad groups are arranged in a first direction. Each of the electrode pad groups includes a first electrode pad, a second electrode pad, and a third electrode pad. The first electrode pad, the second electrode pad, and the third electrode pad are arranged in a second direction. The second direction is different from the first direction. The first electrode pad is disposed between the second electrode pad and the third electrode pad. The first electrode pad is configured to provide a first voltage potential. The second electrode pad and the third electrode pad are configured to provide a second voltage potential. The first voltage potential is different from the second voltage potential.