LED Bonding Pad Layout for Warped Substrate Assembly
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Solution Overview
Problem
Conventional light-emitting diode display panels face challenges in disposing light-emitting diodes on warped substrates due to difficulty in aligning them with bonding pads.
Innovation Solution
A pressure bonding device with a flexible layer is used to attach light-emitting members to bonding pads on a substrate, allowing for alignment and bonding even on curved surfaces by deforming the flexible layer to match the substrate's shape, with specific pitch arrangements to prevent electrode connections to multiple pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If light-emitting diodes are joined to a substrate using conventional methods, then the manufacturing process is simple, but it becomes difficult to dispose the light-emitting diodes on warped substrates
Solution Approach 1:
The patent employs a flexible transfer substrate that can be deformed to match the shape of the target substrate. This flexible substrate allows the light-emitting diodes to be transferred and disposed on warped or non-planar surfaces, thereby resolving the contradiction between adaptability to substrate shape and ease of manufacture.
Solution Approach 2:
The transfer substrate is designed to be dynamically deformable during the transfer process. It can be bent or shaped to conform to the target substrate's geometry, enabling successful deposition of light-emitting diodes on warped surfaces while maintaining a relatively simple manufacturing workflow.
2Reliability
If light-emitting members are arranged with varying pitches, then electrode connections to multiple pads are prevented, but the alignment precision requirement increases
Solution Approach 1:
The patent implements varying pitches (first pitch, second pitch, third pitch) for different groups of light-emitting members along the first direction. This local variation in spacing prevents electrodes from simultaneously connecting to multiple bonding pads, thereby improving electrical connection reliability while managing alignment precision requirements through controlled pitch differentiation.
Data Source
AI summary
An electronic device is provided, including a substrate, a plurality of bonding pads, and a plurality of light emitting members. The bonding pads are disposed on the substrate. The light emitting members are disposed on the bonding pads. The light emitting members include a first pair of adjacent light-emitting members, a second pair of adjacent light-emitting members, and a third pair of adjacent light-emitting members. The first pair of adjacent light-emitting members, the second pair of adjacent light-emitting members, and the third pair of adjacent light-emitting members are arranged along the first direction in sequence. The first pair of adjacent light-emitting members has a first pitch, the second pair of adjacent light-emitting members has a second pitch, and the third pair of adjacent light-emitting members has a third pitch. The third pitch is greater than the second pitch, and the second pitch is greater than the first pitch.