Light Emitting Device Pad Relocation for Light Extraction
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Solution Overview
Problem
Conventional light emitting devices face challenges in optimizing light extraction efficiency and reducing light loss due to the placement of electrodes and pads, which can lead to inefficiencies in energy conversion and emission.
Innovation Solution
A light emitting device structure is developed with a light emitting structure layer comprising a first and second conductive type semiconductor layer, a conductive layer, a bonding layer, and support member, where pads are positioned under the support member rather than on the light emitting structure layer, and electrodes are connected between the semiconductor layers and pads, allowing for improved light extraction and reduced wire bonding losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If pads are placed on the light emitting structure layer, then electrical connection is achieved, but light extraction efficiency decreases and light loss increases
Solution Approach 1:
The patent relocates the pads from the top surface (light emitting structure layer) to the bottom surface (support member) of the device, utilizing the third dimension (vertical positioning) to resolve the conflict between electrical connection requirements and light extraction efficiency. This dimensional relocation eliminates pad-induced light loss while maintaining electrical functionality.
Solution Approach 2:
Instead of placing pads on the light emitting structure layer (conventional approach), the patent inverts the pad placement strategy by positioning them on the support member at the opposite end of the device structure. This inversion resolves the technical contradiction by removing pads from the light path while preserving electrical connection capabilities.
2Loss of energy
If electrodes are connected to pads on the light emitting structure layer, then electrical connection is established, but wire bonding losses occur
Solution Approach 1:
The patent moves the electrical connection interface from the top dimension (light emitting structure layer) to the bottom dimension (support member), eliminating the need for wire bonding across the light path. This dimensional repositioning reduces energy loss while simplifying the manufacturing process by eliminating complex wire bonding steps.
Solution Approach 2:
The patent extracts the pads and electrical connection interface from the light emitting structure layer, removing the source of wire bonding losses. By separating the electrical connection function from the light emission function, the patent eliminates energy loss while maintaining manufacturing feasibility through direct bonding methods.
3Illumination intensity
If pads are positioned on the light emitting structure layer, then electrical connection is achieved, but light extraction efficiency is reduced
Solution Approach 1:
The patent utilizes vertical dimensional relocation to position pads on the support member instead of the light emitting structure layer. This dimensional separation allows light to be emitted from the top surface without obstruction from pads, maximizing light extraction efficiency while maintaining electrical connection functionality at the bottom surface.
Solution Approach 2:
The patent segments the device into distinct functional zones: the light emitting structure layer at the top for light emission and the support member at the bottom for electrical connection. This segmentation separates the optical and electrical functions, allowing each to optimize its performance without interference from the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light extraction efficiency and reduces light loss by eliminating the need for pads on the light emitting structure layer, thereby improving the overall performance of the light emitting device.
Implementation Method 1
LEDs are a kind of semiconductor device that is used as a light source or uses the characteristics of compound semiconductors to convert electricity into infrared rays or light
Data Source
AI summary
Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure layer, a conductive layer, a bonding layer, a support member, first and second pads, and first and second electrodes. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The conductive layer is disposed under the light emitting structure layer. The bonding layer is disposed under the conductive layer. The support member is disposed under the bonding layer. The first pad is disposed under the support member. The second pad is disposed under the support member at a distance from the first pad. The first electrode is connected between the first conductive type semiconductor layer and the first pad. The second electrode is connected between the bonding layer and the second pad.