LED Bonding Pad Repair Using Dual Bonding Material Profiles
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Solution Overview
Problem
Manufacturers face challenges in improving the repair technique for defective light emitting elements in display devices, which affects the fabrication yield and performance of electronic devices like smartphones and head-up displays.
Innovation Solution
The method involves a substrate with connecting pads and conductive lines, where defective light emitting units are identified and replaced using a second bonding material with a different profile from the first bonding material, ensuring electrical connection and uniform brightness/color performance of the repairing units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single bonding material is used for all light emitting units, then the manufacturing process is simple, but defective units cannot be effectively replaced with different bonding requirements
Solution Approach 1:
The patent divides the bonding material system into multiple types (first bonding material and second bonding material) with different properties. Each type is assigned to specific light emitting units based on their bonding requirements, enabling differentiated bonding strategies while maintaining overall system functionality.
Solution Approach 2:
Different bonding materials are applied to different regions or types of light emitting units based on their specific needs. The first bonding material is used for initially formed light emitting units while the second bonding material is used for replacement units, allowing each region to have optimized bonding characteristics.
2Reliability
If defective light emitting units are replaced, then the yield and reliability improve, but the brightness and color uniformity may deteriorate
Solution Approach 1:
The patent modifies bonding parameters (using different bonding materials with different profiles) for replacement light emitting units compared to initially formed units. By adjusting the bonding material properties and application parameters, the patent achieves proper electrical connection and mechanical bonding while maintaining brightness and color uniformity across all units.
Data Source
AI summary
An electronic device includes a substrate, a plurality of connecting pads, a plurality of conductive portions overlapped with the plurality of connecting pads, a plurality of conductive lines, a semiconductor component, and a bonding material. The semiconductor component is disposed on at least one of the plurality of connecting pads and includes an electrode. In a cross-sectional view, a first portion of the bonding material is disposed between the electrode and the at least one of the plurality of connecting pads, a second portion of the bonding material contacts a lateral surface of the electrode, and a boundary between the bonding material and the at least one of the plurality of connecting pads is irregular.