LED Lighting Apparatus Pads with Protective Resin Layer
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Solution Overview
Problem
LED lighting apparatuses face reduced brightness due to light absorption in damaged boards or wiring patterns caused by oxidation or sulfurization, which affects the efficiency of light emission.
Innovation Solution
The use of a protective layer made of a mixture of resin material and white material, such as titanium oxide, covering the pads of the wiring pattern to prevent damage and absorption of light, combined with a glass layer interposed between the bank and LED chips, and a sealing resin that emits light of a different wavelength to enhance brightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the board or wiring pattern is exposed without protection, then the structure remains simple, but light absorption occurs due to oxidation or sulfurization, reducing brightness
Solution Approach 1:
A protective layer is introduced as an intermediary between the wiring pattern pads and the external environment. This protective layer prevents direct contact between the pads and oxidizing or sulfurizing agents, thereby maintaining brightness by preventing light absorption while protecting the electrical conduction paths.
Solution Approach 2:
The protective layer is formed as a composite material structure, potentially combining multiple materials with complementary properties. This composite structure provides both optical transparency (to maintain brightness) and chemical resistance (to prevent oxidation and sulfurization).
2Illumination intensity
If a protective layer is added to cover the pads, then light absorption is prevented and brightness is maintained, but the device structure becomes more complex
Solution Approach 1:
The protective layer serves multiple functions simultaneously: it protects the pads from oxidation and sulfurization, maintains optical transparency to preserve brightness, and provides a smooth surface for subsequent sealing resin application. This multi-functionality reduces the need for additional separate protective components.
Solution Approach 2:
The protective layer formation is integrated with the existing manufacturing process flow, combining the protection function with the sealing and encapsulation steps. This merging approach avoids adding separate complex protection mechanisms while achieving the desired protective effect.
3Reliability
If the protective layer covers the pads completely, then light absorption is prevented, but light emission efficiency may be reduced due to additional material layers
Solution Approach 1:
The protective layer is applied selectively to specific regions where protection is most needed, such as the pads and critical wiring areas, rather than uniformly across the entire surface. This localized application minimizes the total amount of material that could potentially absorb light while providing adequate protection where required.
Solution Approach 2:
The protective layer is designed with optimized optical parameters, including high transparency in the visible spectrum and appropriate thickness control. By adjusting these parameters, the layer provides effective protection while minimizing light absorption and maintaining high emission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents light absorption in damaged areas, maintains high reflectivity, and efficiently directs light outward, resulting in high brightness and improved light emission efficiency.
Implementation Method 1
the board or a wiring pattern formed on the board is damaged due to oxidation or sulfurization
Implementation Method 2
the board or a wiring pattern formed on the board is damaged due to oxidation or sulfurization
Implementation Method 3
The sealing resin is mixed with fluorescent material emitting light having a wavelength different from a wavelength of light from the LED chips by being excited by the light from the LED chip
Data Source
AI summary
An LED lighting apparatus is disclosed. The LED lighting apparatus includes a substrate having a first surface; at least one connection body formed by LED chips arranged side by side in a first direction over the first surface of the substrate; and a circular protruding portion, arranged over the first surface of the substrate, surrounding the plurality of LED chips. The LED lighting apparatus further includes a first wiring pattern, arranged over the first surface of the substrate; and a second wiring pattern, arranged over the first surface of the substrate and spaced apart from the first wiring pattern.