LED Pads with Protrusions for Enhanced Bonding Stability
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Solution Overview
Problem
The instability of the bonding between light emitting diodes (LEDs) and substrates in Surface Mount Technology (SMT) leads to issues with the bonding pad falling off, increasing production costs and affecting LED performance, as the existing methods require a larger bonding pad area and strict process control.
Innovation Solution
A light emitting device with protrusions on the electrode pads embedded in a bonding substance, such as solder, which increases the contact area with the substrate without enlarging the pad area, enhancing bonding stability and facilitating heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding pad area is increased to improve bonding stability, then the stability of bonding between LED and substrate is improved, but the production cost of LED increases
Solution Approach 1:
The patent transitions from a two-dimensional bonding pad surface to a three-dimensional structure by adding protrusions (micro bumps) on the bonding pad surface. This dimensional change increases the bonding area and mechanical interlocking without increasing the planar pad area, thereby improving bonding stability without increasing production cost
Solution Approach 2:
The bonding pad surface is segmented into multiple protrusions (micro bumps) rather than a flat surface. This segmentation increases the effective bonding area and creates multiple bonding points, improving overall bonding stability while maintaining the same pad footprint area
2Reliability
If the bonding pad area is increased to improve bonding stability, then the stability of bonding between LED and substrate is improved, but the device complexity increases
Solution Approach 1:
By adding vertical protrusions to the pad surface, the invention resolves the contradiction between bonding stability and structural complexity. The protrusions can be formed through standard semiconductor processing techniques, adding minimal complexity while significantly improving bonding through increased surface area and mechanical interlocking
3Reliability
If the pad area is increased to improve bonding stability, then the bonding stability is improved, but the heat dissipation efficiency decreases due to larger area occupation
Solution Approach 1:
The protrusions on the pad surface provide additional vertical heat dissipation pathways through the bonding substance to the substrate. This three-dimensional heat dissipation structure improves thermal management without increasing the planar area occupied by the pad, thus maintaining heat dissipation efficiency while improving bonding stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves bonding stability between LEDs and substrates, reduces manufacturing costs, and extends the life of LEDs by increasing the contact area with the substrate while maintaining a constant pad area, thus addressing the instability and cost issues in SMT.
Implementation Method 1
The surface of the positive electrode pad and/or the negative electrode pad is provided with a plurality of protrusions embedded in the bonding substance; and the positive electrode pad and the negative electrode pad are fixed to the substrate through the bonding substance
Implementation Method 2
the projection provided on the pad on the light-emitting diode facilitates heat dissipation and extends the life of the light-emitting diodes
Data Source
AI summary
The present application relates to a light emitting diode, a light emitting device, and a display device. The light emitting device includes a light emitting diode and a substrate; the substrate is coated with a bonding substance; the light emitting diode is provided with a positive electrode pad and a negative electrode pad; the surface of the positive electrode pad and/or the negative electrode pad is provided with a plurality of protrusions which are embedded in the bonding substance; and the positive electrode pads and the negative electrode pads are fixed to the substrate through the bonding substance. The embodiment of the present application provides projections on the pad of the light emitting diode, avoids the need of increasing the area of the pad, increases the contact area between the pad and the solder with the constant pad area, improves the bonding stability between the light emitting diode and the substrate, and reduces the production cost.