LED Display Panel Assembly With Adjustable Adhesion for Chip Repair

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Solution Overview

Problem

Current LED display panels face cumbersome detection and repairing of LED chips due to fixed connections, leading to low efficiency.

Innovation Solution

The use of conductive members with adjustable adhesion, such as photocuring conductive adhesive, allows for adjustable fixation of LED chips on a substrate, enabling direct replacement or repair of defective chips without disassembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If LED chips are fixedly connected to the substrate using conventional conductive adhesives, then the electrical connection and mechanical fixation are ensured, but the detection and repair of bad LED chips becomes cumbersome and time-consuming

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoiddetection and repair efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent applies the dynamics principle by using a photocuring conductive adhesive that transitions from a state allowing easy disassembly to a state providing strong fixation. Before detection, the adhesive remains in an uncured state with low adhesion, enabling easy replacement of LED chips. After detection identifies good chips, visible light irradiates the adhesive to cure it, transforming it into a high-adhesion state that securely fixes the chips. This dynamic state change resolves the contradiction between ensuring reliable connection and enabling efficient repair.

Inventive Principle:
Principle #15Dynamics

2Stability of the object's composition

If LED chips are firmly fixed on the substrate, then the mechanical stability is improved, but the ease of replacing defective chips is reduced

Engineering Contradiction:
Improvemechanical stabilityVSAvoidease of replacing defective chips
Core Design Contradiction:
Stability of the object's compositionVSEase of repair

Solution Approach 1:

The patent applies the parameter changes principle by controlling the adhesion parameter of the conductive adhesive through photocuring. The adhesive's adhesion strength is not fixed but can be changed from low to high state. Before repair, the adhesive maintains low adhesion parameters allowing easy chip removal. After identifying defective chips and replacing them, visible light irradiation changes the adhesion parameter to high strength, securely fixing the replaced chips. This parameter change resolves the contradiction between mechanical stability and ease of repair.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If conventional conductive adhesives are used to connect LED chips, then the electrical conductivity is achieved, but the ability to adjust adhesion for different repair stages is lost

Engineering Contradiction:
Improveelectrical conductivityVSAvoidadhesion adjustability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies the phase transitions principle by utilizing the photocuring process that transforms the conductive adhesive from a liquid-like uncured state to a solid cured state. This phase transition is triggered by visible light irradiation after detection identifies good LED chips. The uncured state provides low adhesion for easy replacement, while the cured state provides high adhesion for secure fixation. This phase transition mechanism provides the needed adaptability while maintaining electrical conductivity throughout the process.

Inventive Principle:
Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the efficiency of LED detection and repair by allowing direct replacement and fixation of abnormal chips, improving overall detection and repair efficiency.

Implementation Method 1

the conductive members include a photocuring conductive adhesive, and the photocuring conductive adhesive is changed from a liquid state to a solid state under a visible light condition

Methodology Applied
Scientific EffectPhotocuring: Photopolymerisation

Data Source

PatentUS12550504B2LED display panel and manufacturing method thereof
Publication Date: 2026.02.10 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US12550504B2 patent drawing
  • US12550504B2 patent drawing
  • US12550504B2 patent drawing

AI summary

A light-emitting diode (LED) display panel and a manufacturing method thereof are provided. The LED display panel includes a substrate, an LED array, and conductive members. The LED array includes a plurality of LED chips disposed on the substrate in an array. The conductive members are disposed between the LED chips and the substrate. The LED chips are fixed onto and electrically connected to the substrate by the conductive members, and the conductive members have adhesion, and the adhesion is adjustable.