LED Panel Light Fixtures with Passive Thermal Management
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Solution Overview
Problem
Existing LED light sources with high intensity point sources require extensive thermal heatsinking, leading to performance degradation due to airflow restrictions and safety concerns, especially in residential applications where fixtures are often insulated, and require periodic maintenance due to susceptibility to environmental factors.
Innovation Solution
A panel light fixture using a thermally conductive luminescent element with a solid state light source, such as a light emitting diode, that converts light into a broader emission spectrum, providing both cooling and diffusion, and optionally integrating solar and energy storage means for self-sustaining operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high intensity point source LED light sources are used, then light intensity and efficiency are improved, but thermal management complexity and safety hazards increase
Solution Approach 1:
The patent segments the light source into multiple low-power LED chips distributed across a large area substrate, replacing a single high-intensity point source. This segmentation distributes heat generation across many small sources, eliminating the need for complex thermal management while maintaining overall light intensity through additive effect.
Solution Approach 2:
The patent transitions from a point source (0D) to a distributed planar array (2D) of LED chips. This dimensional change spreads the light and heat generation across a large area, enabling passive thermal management through surface area while maintaining illumination intensity through spatial distribution.
2Temperature
If extensive thermal heatsinking is used for high intensity point sources, then cooling efficiency is improved, but weight and safety hazards increase
Solution Approach 1:
The patent extracts and eliminates the heavy heatsink component entirely by removing the high-intensity point source that necessitated it. The distributed low-power LED array generates sufficient heat that can be dissipated passively through the substrate and ambient air, making heavy active cooling unnecessary.
Solution Approach 2:
The patent enables the light fixture to self-cool through passive convection and radiation from the large surface area substrate, eliminating the need for external heavy heatsinks. The distributed heat generation across many small LEDs allows natural heat dissipation without additional cooling components.
3Productivity
If high intensity point sources are used, then light output efficiency is improved, but performance degradation due to airflow restriction increases
Solution Approach 1:
The patent segments the light source into multiple distributed LED chips, allowing air to flow freely between and around them. This segmentation prevents airflow restriction and heat buildup that would degrade the performance of a single high-intensity point source, maintaining stable light output efficiency.
4Temperature
If distributed array of LEDs is used, then thermal management is improved, but device area increases
Solution Approach 1:
The patent uses a thin flexible or rigid substrate to mount the distributed LED array, allowing the light source to conform to various fixture geometries. This thin-film approach provides large surface area for thermal management while minimizing the overall volume and footprint of the fixture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient cooling and safe illumination with reduced maintenance needs, as the thermally conductive luminescent element diffuses light and provides a cooling path, allowing for compact, directional, or isotropic light distribution without additional heatsinking, suitable for residential and commercial use.
Implementation Method 1
A light emitting diode, such as those in U.S. Published Patent Applications 20080182353 and 20080258165, commonly assigned as the present application and herein incorporated by reference, will emit light of a first wavelength and that first wavelength light will be converted into light of a second wavelength by the wavelength conversion chip.
Implementation Method 2
the distributed nature of the sources allows for cooling via natural convection means as long as sufficient airflow is allowed by the light fixture eliminating or greatly reducing the need for additional heatsinking means
Implementation Method 3
Electricity passes through an active region of semiconductor material to emit light in a light emitting diode.
Data Source
AI summary
Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source.