Light Emitting Panel With Stacked Conductive Layers For Dense LED Disposal
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Solution Overview
Problem
It is challenging to densely pack Light Emitting Diodes (LEDs) on a light transmissive substrate while managing wiring constraints, which limits the ability to express various patterns effectively.
Innovation Solution
A light emitting panel comprising multiple light emitting modules with a light transmissive first and second insulation film, a conductive layer on at least one of the films, and LEDs disposed between them to form a predetermined pattern, connected to the conductive layer, allowing for flexible and transparent display patterns by applying different voltages to mesh patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If LEDs are disposed on a light transmissive substrate, then the display structure becomes flexible and transparent, but wiring constraints increase and dense disposal becomes difficult
Solution Approach 1:
The patent transitions from planar wiring to three-dimensional wiring by routing conductors through the thickness direction of the substrate. Multiple wiring layers are stacked in the Z-direction, allowing signals to reach LEDs positioned at different heights without crossing paths on the same plane, thus resolving wiring constraints while maintaining display flexibility
Solution Approach 2:
The patent implements nested wiring structures where multiple wiring layers are stacked within the substrate thickness. Inner wiring layers are enclosed by outer layers, creating a compact multi-layer conductor system that provides multiple signal paths through the substrate volume, enabling dense LED disposal without increasing surface wiring complexity
2Manufacturing precision
If LEDs are densely disposed, then display resolution improves, but wiring constraints and manufacturing difficulty increase
Solution Approach 1:
The patent divides the wiring system into multiple independent wiring layers stacked in the thickness direction. Each layer handles specific signal routes, segmenting the complex wiring task into manageable layers. This segmentation allows dense LED disposal by providing dedicated wiring paths for each LED or small LED group without creating routing conflicts
Solution Approach 2:
The patent adds the thickness dimension to wiring layout, creating a three-dimensional wiring architecture. Conductors are distributed across multiple Z-levels, allowing dense LED disposal on the XY-plane while routing signals through the Z-direction to avoid crossings and reduce wiring management difficulty
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of flexible, transparent, and densely packed LED displays with varied patterns, enhancing the expression of complex designs and maintaining low power consumption.
Implementation Method 1
a plurality of light emitting elements 30 which is disposed between the first insulation film 21 and the second insulation film 22
Implementation Method 2
Light Emitting Diodes (LEDs) that have relatively little power consumption are getting attention as a next-generation light source
Data Source
AI summary
A light emitting panel according to this embodiment includes a plurality of light emitting modules, and the plurality of light emitting modules each include: a first insulation film that is light transmissive; a second insulation film which is disposed so as to face the first insulation film, and which is light transmissive; a conductive layer formed on at least either one of the first insulation film or the second insulation film; and a plurality of light emitting elements which is disposed between the first insulation film and the second insulation film, is disposed so as to form a predetermined pattern, and is connected to the conductive layer.