LED Module With Partial Heat Sink For Easy Replacement

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Solution Overview

Problem

Existing LED modules require complex and costly replacement processes, involving thermal interface materials and specialist intervention, which can contaminate LEDs and result in high replacement costs, especially when replacing high-power LEDs.

Innovation Solution

An LED module design featuring a partial heat sink with an electrically conducting carrier embedded in an electrically insulating and thermally conducting surround, allowing for easy coupling and decoupling without thermal interface materials, enabling self-alignment and simplified replacement by users.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If LED modules are directly mounted to a heat sink with thermal interface materials, then heat transfer efficiency is improved, but replacement complexity and cost increase significantly

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidreplacement complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The heat sink is divided into a first heat sink part (removable module) and a second heat sink part (fixed base). The LED module is mounted on the first part which can be easily detached from the second part, enabling simple replacement without specialized tools or materials while maintaining thermal contact through the interface between the two parts.

Inventive Principle:
Principle #1Segmentation

2Loss of energy

If thermal interface materials are used to connect LED module to heat sink, then heat transfer is improved, but contamination risk and specialist intervention requirement increase

Engineering Contradiction:
Improveheat transferVSAvoiduser replacement ease
Core Design Contradiction:
Loss of energyVSEase of operation

Solution Approach 1:

The invention extracts and eliminates the thermal interface material from the system by designing a direct mechanical and thermal connection between the first and second heat sink parts. The LED module with its integrated heat sink portion couples directly to the fixed heat sink base through precise mechanical interfaces, removing the need for thermal gels or pastes that cause contamination and require specialist application.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of operation

If LED modules are mounted on a multi-part heat sink with detachable first part, then replacement ease is improved, but thermal interface complexity increases

Engineering Contradiction:
Improvereplacement easeVSAvoidheat sink structure complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The invention merges the LED module mounting function with the first heat sink part, creating an integrated assembly where the LED module and its heat sink portion form a single replaceable unit. This integration simplifies the overall structure by combining multiple functions into unified components rather than separate elements.

Inventive Principle:
Principle #5Merging (Combining)

4Reliability

If full heat sink is replaced when LEDs fail, then reliability is maintained, but cost and waste increase significantly

Engineering Contradiction:
ImproveLED module reliabilityVSAvoidmaterial waste
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The heat sink is segmented into a replaceable first part (with LED module) and a permanent second part (fixed base). When LEDs fail, only the first part needs replacement while the second part remains in use, dramatically reducing material waste and replacement cost while maintaining system reliability through easy module replacement.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design facilitates cost-effective and user-friendly LED module replacement, reducing contamination risks and operational costs by allowing the LED module to be replaced as a single unit without the need for full heat sink disposal, while maintaining effective heat transfer and optical performance.

Implementation Method 1

an electrically insulating and thermally conducting surround

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat sink portion; and an LED arrangement mounted on the heat sink portion

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentEP3278018B1LED lighting module with heat sink and a method of replacing an LED module
Publication Date: 2021.09.22 LUMILEDS LLC
  • EP3278018B1 patent drawingFigure 1~2
  • EP3278018B1 patent drawingFigure 3
  • EP3278018B1 patent drawingFigure 4~5

AI summary

An LED module (1) combines a heat sink portion (10) and an LED arrangement (12). The heat sink portion (10) is a first part of a multiple part heat sink having at least this first part (10) and a second part (40). The heat sink portion (10) is not sufficient alone to provide the required cooling for the operation of the LED arrangement (12) so it can be small and low cost. A user can simply replace the LED module (1) as a single unit, without the significant waste and cost of disposing of the full heat sink.