LED Apparatus with Patterned Heat Sink Plate for Thermal Management
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Solution Overview
Problem
The existing LED manufacturing process is complex and costly due to the need for separate manufacturing of red, green, and blue LEDs, which can result in color deviations and poor heat-proof performance, and requires additional processes to prevent oxygen and moisture ingress.
Innovation Solution
An LED apparatus with a heat sink plate and fluorescence layers that prevent light mixing and enhance heat dissipation, combined with a manufacturing method that includes a patterned heat sink plate, black sealant, and glass layer to improve heat sink performance and reduce manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If three LEDs (red, green, blue) are manufactured separately and combined into one LED, then color accuracy can be maintained, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent combines multiple LED chips (red, green, blue) and quantum dot layers into a single integrated LED apparatus structure, where all components are mounted on one substrate and sealed together. This merging approach maintains color accuracy through precise spatial arrangement while simplifying the manufacturing process by treating it as a single integrated unit rather than separate assemblies.
Solution Approach 2:
The LED apparatus is designed as a multi-functional integrated unit that simultaneously performs light emission from multiple LED chips, optical wavelength conversion through quantum dots, and hermetic sealing. The single apparatus structure replaces multiple separate manufacturing and assembly processes, reducing overall complexity while maintaining color precision.
2Reliability
If Quantum Dot is adhered on top of LED and sealed with glass package, then optical conversion characteristics are protected, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The patent integrates the quantum dot layer, LED chips, and sealing structure into a single manufactured unit. The quantum dots are positioned directly on the substrate alongside the LED chips, and the entire assembly is sealed together in one process. This merging eliminates separate packaging steps while maintaining protection of optical conversion characteristics.
Solution Approach 2:
The quantum dot layer is nested within the integrated LED apparatus structure, positioned between the substrate and the sealing layer. This nested arrangement protects the quantum dots from environmental damage while maintaining their optical functionality, and the entire nested structure is manufactured as one unit rather than assembled from separate packaged components.
3Manufacturing precision
If separate manufacturing processes are used for each LED, then quality control is easier, but manufacturing time and costs increase
Solution Approach 1:
The patent enables multiple LED chips and quantum dot layers to be manufactured and assembled in a single integrated process on one substrate. This merging maintains quality control through consistent manufacturing conditions for all components while dramatically improving productivity by eliminating repeated manufacturing cycles and reducing the number of separate assembly operations.
4Reliability
If glass package and plastic mold are used for sealing, then protection from oxygen and moisture is achieved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent employs a composite sealing structure that combines materials with different properties: the substrate provides structural support and thermal pathways, the quantum dot layer provides optical conversion, and the sealing layer provides environmental protection. This composite approach maintains heat dissipation through the substrate while achieving protection from oxygen and moisture through the sealing structure, resolving the trade-off between protection and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat sink performance, reduces manufacturing time and costs, and improves the longevity of the LED apparatus by preventing light mixing and enhancing heat dissipation, while simplifying the manufacturing process.
Implementation Method 1
a heat sink plate provided on a first side of the plurality of substrate layers
Implementation Method 2
a fluorescence provided on the heat sink plate overlapping at least a portion of one of the plurality of substrate layers
Implementation Method 3
emit the converted light outside by diffusing the light
Implementation Method 4
The patterned area of the heat sink plate may be configured to prevent lights emitted from the plurality of light emitting diodes and passing through the plurality of substrate layers from mixing with one another
Data Source
AI summary
An LED apparatus is provided. The LED apparatus includes a plurality of substrate layers, each substrate layer corresponding to one of a plurality of sub-pixels of a pixel; a heat sink plate provided on a first side of each substrate layer, the heat sink plate including a patterned area provided between adjacent substrate layers of the plurality of substrates layers; a fluorescence provided on the heat sink plate overlapping at least a portion of one of the plurality of substrate layers; and a plurality of light emitting diodes, each light emitting diode formed on a second side opposite to the first side of each substrate layer.