LED Thermal Management via PCB Conductor Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
LED-based lighting systems face challenges in efficient heat dissipation, which affects the operating temperature and lifespan of LEDs, and existing PCB materials like metal core and ceramic are costly and difficult to manufacture.
Innovation Solution
The use of a printed circuit board (PCB) with conductors on its front-side thermally coupled to a housing, where LEDs are mounted to emit light through apertures, allowing heat to dissipate primarily through the conductors and housing, and a retrofit apparatus with a thermally conductive mounting bracket that attaches to light fixtures to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal core PCB or ceramic material is used for heat dissipation, then heat dissipation performance is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent uses standard epoxy glass PCB material instead of expensive metal core or ceramic substrates. The PCB is designed to be a cost-effective solution that provides adequate heat dissipation through the conductor traces, eliminating the need for costly specialized substrates while maintaining manufacturability and ease of assembly.
Solution Approach 2:
The conductor traces on the PCB serve dual functions: electrical connection and heat dissipation. The PCB structure itself provides the thermal management function through its inherent conductor network, eliminating the need for separate heat dissipation components or specialized substrates.
2Temperature
If heat dissipation structures are added to improve thermal management, then operating temperature is reduced, but device complexity increases
Solution Approach 1:
The PCB conductors perform multiple functions simultaneously: electrical connection and heat dissipation. By making the conductor traces thermally coupled to the housing, the same structural element serves dual purposes, reducing overall device complexity while achieving thermal management goals.
Solution Approach 2:
The patent merges the electrical connection function and heat dissipation function into a single integrated structure. The conductor traces on the PCB are designed to conduct both electricity and heat to the housing, combining what would traditionally be separate functions into one unified system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the operating temperature of LEDs, improving their lifespan and efficiency while using cost-effective epoxy glass PCBs and providing a sleek appearance and easy rework, and allows for superior heat dissipation compared to traditional methods.
Implementation Method 1
The PCB is mounted with the conductors proximate to and thermally coupling with a surface of the housing such that heat generated by the one or more LEDs primarily dissipates through the conductors to the housing
Data Source
AI summary
An LED-based lighting system includes a housing forming one or more apertures, a PCB having conductors on its front-side, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a top surface of the housing such that the LEDs emit light through the apertures, and heat generated by the one or more LEDs primarily dissipates through the conductors to the housing. A retrofit apparatus for a light fixture includes a PCB having conductors on its front-side thereof, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a surface of a mounting bracket that is configured for mounting to the light fixture, such that when the bracket mounts to the light fixture, heat generated by the one or more LEDs primarily dissipates through the conductors and the structural element to the light fixture.