LED PCB Recessed in LCD Bottom Cover for Thermal Management

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Solution Overview

Problem

LCD modules using LEDs face challenges with thickness, heat management, and assembly complexity due to the use of metal core printed circuit boards, which affect brightness and reliability.

Innovation Solution

The design incorporates a recessed portion in the bottom cover to house the printed circuit board and LED, with a reflective sheet and optical sheets to enhance light distribution, and eliminates the need for additional fixing members, allowing for reduced thickness and improved heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If metal core printed circuit boards are used to support LEDs, then structural support and heat dissipation are improved, but device thickness increases and assembly complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoiddevice thickness
Core Design Contradiction:
TemperatureVSLength of moving object

Solution Approach 1:

The patent embeds the printed circuit board within a recessed cavity formed in the bottom cover, nesting the PCB inside the cover structure rather than placing it externally. This allows the metal core PCB to provide heat dissipation and structural support while occupying no additional external space, thereby maintaining thin device profile while achieving effective thermal management.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from a planar arrangement where the PCB sits on the external surface of the bottom cover to a three-dimensional arrangement by creating a recessed cavity. This dimensional change allows the PCB to be integrated within the cover's thickness, effectively utilizing internal volume to eliminate external thickness increase.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Strength

If metal core printed circuit boards are used to support LEDs, then structural support and heat dissipation are improved, but device assembly complexity increases

Engineering Contradiction:
Improvestructural supportVSAvoidassembly complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent merges the bottom cover and the printed circuit board into a single integrated assembly by forming the PCB within a recessed cavity of the cover. The reflective sheet is also integrated into this assembly, creating a unified structure that provides structural support, heat dissipation, and light reflection functions simultaneously, thereby simplifying the overall assembly process.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The bottom cover with the recessed cavity serves multiple functions: it provides structural support, acts as a heat sink for the metal core PCB, serves as a mounting structure for the LEDs, and the reflective sheet integrated into the cavity provides light redirection. This multi-functionality reduces the need for separate components and simplifies assembly.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If additional fixing members are used to secure the printed circuit board, then assembly reliability is improved, but device complexity and assembly steps increase

Engineering Contradiction:
Improveassembly reliabilityVSAvoidassembly steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The recessed cavity structure provides self-fixing capability through friction and geometric constraint. The printed circuit board is retained in the cavity by the physical interference fit and friction between the PCB edges and the cavity walls, eliminating the need for additional fixing members such as screws or adhesives. This self-service retention mechanism simplifies assembly while maintaining reliability.

Inventive Principle:
Principle #25Self-service

4Length of moving object

If the bottom cover is made thinner to reduce overall device thickness, then device profile is improved, but space for heat dissipation and component mounting is reduced

Engineering Contradiction:
Improvedevice thicknessVSAvoidheat dissipation space
Core Design Contradiction:
Length of moving objectVSTemperature

Solution Approach 1:

The patent nests the printed circuit board and LED assembly within a recessed cavity formed in the bottom cover itself. By utilizing the internal volume created by the recess, the design accommodates the thickness of the metal core PCB and allows for effective heat dissipation pathways without increasing the external thickness of the bottom cover, thereby maintaining a thin device profile while providing sufficient thermal management space.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the overall thickness of the LCD module, enhances brightness by effective heat management, and simplifies assembly, leading to increased LED lifespan and improved display performance.

Implementation Method 1

a reflective sheet and optical sheets to enhance light distribution

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS8013948B2Liquid crystal display device having light emitting diode printed circuit board recessed within the bottom cover
Publication Date: 2011.09.06 LG DISPLAY CO LTD
  • US8013948B2 patent drawing
  • US8013948B2 patent drawing
  • US8013948B2 patent drawing

AI summary

A liquid crystal display device includes a liquid crystal display panel, a printed circuit board with a bottom side surface and at least two side surfaces positioned under the liquid crystal display panel and a light emitting diode positioned on an inner surface of the printed circuit board. The liquid display device additionally includes a bottom cover positioned under the printed circuit board with a recessed portion under the printed circuit board wherein the bottom side surface and the two side surfaces of the printed circuit board contact the bottom cover.