LED Package Substrate Integration via Penetrating Electrodes
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Solution Overview
Problem
Conventional LED packages require additional substrates, leading to increased size and manufacturing costs due to additional package processes.
Innovation Solution
The LED package design incorporates a light-emitting structure with electrode pads, an insulating pattern layer, substrate via-holes, penetrating electrodes, a fluorescent material layer, and glass, optimizing size and cost by eliminating the need for additional substrates and using adhesive and support layers to enhance durability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If an additional substrate is used in the LED package, then the structural stability is improved, but the package size increases and manufacturing cost increases
Solution Approach 1:
The patent merges the substrate and lead frame into a single integrated structure where the lead frame is directly formed on the substrate surface. This eliminates the need for separate substrate and lead frame components, reducing the overall package size while maintaining structural stability through the unified design. The integrated structure allows electrical connections to be established directly through the substrate without requiring additional packaging processes.
2Stability of the object's composition
If an additional substrate is used in the LED package, then the structural stability is improved, but the manufacturing cost increases due to additional package processes
Solution Approach 1:
The patent combines the substrate and lead frame functions into a single manufacturing process, where the lead frame is formed directly on the substrate. This integration eliminates multiple packaging steps, reduces manufacturing complexity, and lowers production costs while maintaining the structural stability required for reliable LED operation.
3Area of stationary object
If the package size is reduced, then the manufacturing cost is reduced, but the structural stability may be compromised
Solution Approach 1:
The integrated substrate-lead frame structure achieves compact packaging by eliminating separate components, while the unified design ensures structural stability through direct bonding and integrated support. The merged structure provides adequate mechanical strength and electrical connectivity within a reduced footprint.
4Stability of the object's composition
If additional package processes are used, then the structural stability is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent integrates the lead frame formation into the substrate manufacturing process, eliminating the need for separate lead frame attachment and wiring steps. This merged approach reduces package process complexity while maintaining structural stability through the integrated design that ensures proper mechanical and electrical support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a compact LED package with reduced manufacturing costs and improved reliability by integrating the necessary components without additional substrates, while maintaining effective light emission and mechanical durability.
Implementation Method 1
a fluorescent material layer disposed on the light-emitting structure
Implementation Method 2
an adhesive material layer disposed between the fluorescent material layer and the glass
Data Source
AI summary
A light-emitting diode package includes a light-emitting structure, a first electrode pad and a second electrode pad connected with the light-emitting structure, an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first and second electrode pads, a substrate including via-holes in contact with a bottom surface of the insulating pattern layer and exposing a portion of the first electrode pad and a portion of the second electrode pad, a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and respectively connected with the first and second electrode pads, a fluorescent material layer disposed on the light-emitting structure, a glass disposed on and spaced apart from the light-emitting structure with the fluorescent material layer therebetween.