LED Light Source Package With Segmented Phosphor Carrier
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Solution Overview
Problem
Conventional COB packaging of LED light sources suffers from poor light-emission uniformity and high cost, along with limited controllability over color temperature and color rendering index, due to non-uniform distribution of phosphor particles and direct contact of the transparent filling layer with LED chips, which leads to decreased transparency and light-emission efficiency over time.
Innovation Solution
A method involving a transparent carrier with regularly arranged red, yellow, and green phosphor patterns, forming a cavity around LED chips on a substrate, where the phosphor patterns are printed on the carrier's surface facing the LEDs, improving light-emission uniformity and allowing for adjustable color temperature and color rendering index by controlling the thickness of the phosphor patterns, while avoiding direct contact with the LED chips to prevent degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If phosphor particles are directly mixed into the transparent filling layer and applied to LED chips, then the manufacturing process is simple, but the light-emission uniformity becomes poor
Solution Approach 1:
The patent divides the filling layer into multiple transparent sub-layers, each containing phosphor particles of different colors (red, green, blue). This segmentation allows for uniform distribution of each phosphor type within its own layer, preventing the aggregation and non-uniformity that occurs when all phosphors are mixed together in a single layer.
Solution Approach 2:
Each transparent sub-layer is designed with specific local properties: the first sub-layer contains red phosphor, the second contains green phosphor, and the third contains blue phosphor. This local differentiation ensures that each region of the filling layer has optimized phosphor distribution for its specific color, achieving overall uniform light-emission across the entire LED package.
2Device complexity
If the transparent filling layer directly contacts LED chips to simplify structure, then the device complexity is reduced, but the light-emission efficiency decreases over time due to degradation
Solution Approach 1:
The patent introduces an intermediate reflective layer positioned between the LED chips and the transparent filling layer. This reflective layer serves as a mediator that redirects light that would otherwise be absorbed by the filling layer back toward the LED chips, maintaining light-emission efficiency over time while keeping the overall structure relatively simple.
Solution Approach 2:
The patent converts the potentially harmful effect of light absorption by the filling layer (which would reduce efficiency) into a beneficial reflective cycle. The reflective layer captures light that passes through or is scattered by the filling layer and redirects it back to the LED chips, turning what would be energy loss into additional useful light output.
3Ease of manufacture
If conventional COB packaging is used to reduce cost, then the cost performance is improved, but the controllability over color temperature and color rendering index is limited
Solution Approach 1:
The patent enables dynamic adjustment of color temperature and color rendering by allowing independent control of the thickness and phosphor composition of each transparent sub-layer. By varying the proportions and characteristics of red, green, and blue phosphors in different layers, the system can dynamically adjust its overall color output to meet different lighting requirements.
Solution Approach 2:
The patent achieves precise control over color temperature and color rendering index by independently adjusting parameters of each phosphor layer, including phosphor concentration, particle size distribution, and layer thickness. This parametric control allows optimization of color properties while maintaining cost-effective COB packaging architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform light-emission, enhances light-emission efficiency, and provides high controllability over color temperature and color rendering index, reducing maintenance costs and improving the overall quality of the LED light source by using a transparent carrier that can be easily replaced.
Implementation Method 1
printing phosphor patterns on a surface of the transparent carrier... the first, the second and the third phosphor patterns are all regular hexagon-shaped or square shaped... convert at least a portion of the received light to light having a longer wavelength
Data Source
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AI summary
A method for packaging LED light source and a package structure of LED light source are provided. The method for packaging LED light source includes providing a substrate integrated with LED chips; providing a transparent carrier; printing phosphor patterns on a surface of the transparent carrier, where the phosphor patterns include one or more first phosphor patterns, one or more second phosphor patterns and one or more third phosphor patterns, where every two of the first, the second and the third phosphor patterns are arranged adjacent to each other; and disposing the transparent carrier printed with the phosphor patterns on a surface of the substrate integrated with the LED chips, where the transparent carrier wraps the LED chips to form a cavity, and the surface of the transparent carrier printed with phosphor patterns faces the LED chips. The package structure of the LED light source has good uniformity of light-emission and low cost, and the method for packaging LED light source has a simple process