LED Package Molding with Reflective Phosphor Cavities
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Solution Overview
Problem
The existing processes for preparing LED package systems are complicated due to the complexity of creating molding structures with reflective surfaces and the random distribution of phosphor in silicone gel, leading to uncontrollable characteristics such as output, color, and voltage in LED packages.
Innovation Solution
A method involving bonding LEDs over a substrate, forming a molding material with openings having reflective surfaces, and dispensing a phosphor-containing material within these openings, which are then covered by a silicone gel, allowing for controlled distribution and placement of phosphor, simplifying the process and improving LED package consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional molding structures with reflective surfaces are prepared, then light reflection is improved, but the process complexity increases
Solution Approach 1:
The patent combines the molding structure preparation and phosphor distribution processes into a single integrated approach. The mold cavity is designed to directly receive and position phosphor particles during the molding process, eliminating the need for separate reflective surface preparation steps while achieving both light reflection and controlled phosphor distribution.
Solution Approach 2:
The molding structure serves multiple functions simultaneously: it forms the package encapsulation, creates the reflective surface, and controls phosphor distribution. The mold cavity design integrates these functions, allowing a single process to achieve what previously required multiple separate steps.
2Ease of manufacture
If phosphor is randomly distributed in silicone gel, then the mixing process is simple, but the LED package characteristics become uncontrollable
Solution Approach 1:
The patent implements local quality control by designing the mold cavity to receive phosphor particles at specific locations and in specific quantities. Different regions of the mold cavity can be optimized for different phosphor distributions, allowing precise control over the phosphor pattern in each LED package while maintaining a relatively simple overall process.
Solution Approach 2:
The mold cavity is pre-designed with features that control phosphor distribution before the actual molding process. The cavity geometry, surface properties, and positioning features are prepared in advance to guide phosphor particle placement, ensuring consistent and controllable characteristics without requiring complex real-time control during manufacturing.
3Manufacturing precision
If separate processes are used for molding and phosphor distribution, then each process can be optimized, but the overall manufacturing complexity increases
Solution Approach 1:
The patent merges the molding process and phosphor distribution process into a single integrated operation. The mold cavity is designed to perform both functions simultaneously, eliminating the need for separate process steps while maintaining the ability to optimize each function through careful cavity design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the LED package formation process, reduces costs, and enables better control over the characteristics of the LED packages, such as output and color, by ensuring precise placement and distribution of the phosphor-containing material.
Implementation Method 1
The opening has a reflective surface along sidewalls of the opening, such that light emitted from the LED can be reflected on the reflector surface
Implementation Method 2
A phosphor/silicone gel is then dispensed and filled within each opening, covering the LED
Data Source
AI summary
A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material.