Light Emitting Device Phosphor Plate Bonding Structure
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Solution Overview
Problem
Existing light emitting devices face challenges in achieving stable adhesion of phosphor plates, leading to discoloration and cracks due to heat, which affects the reliability and accuracy of the bonding process.
Innovation Solution
A light emitting device design that includes a phosphor plate bonded to a light emitting structure using multiple bonding portions with distinct electrodes and bonding layers, allowing for eutectic bonding and improved heat dissipation, eliminating the need for a separate pad exposure process and enhancing adhesion accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If phosphor plates are bonded to light emitting chips using conventional methods, then the bonding process is simple, but adhesion accuracy is poor and heat resistance is insufficient causing discoloration and cracks
Solution Approach 1:
The bonding structure is segmented into multiple bonding portions (first bonding portions and second bonding portions) distributed across the phosphor plate. Each bonding portion has specific functions: first bonding portions provide electrical connection and heat dissipation, while second bonding portions provide mechanical support and additional bonding. This segmentation improves adhesion accuracy and heat resistance without requiring a completely complex new structure.
Solution Approach 2:
Different regions of the bonding structure have different properties tailored to local requirements. The first bonding portions are designed with electrical conductivity and heat dissipation capabilities, while the second bonding portions focus on mechanical bonding strength. The electrodes and bonding layers have varying thicknesses and material compositions optimized for their specific locations and functions.
2Manufacturing precision
If multiple bonding portions with electrodes and bonding layers are used, then adhesion accuracy and heat resistance improve, but the manufacturing process becomes more complex
Solution Approach 1:
Multiple functions are merged into the bonding structure: electrical connection, heat dissipation, mechanical bonding, and structural support are all integrated into the bonding portions. The electrodes serve both as electrical conductors and as heat dissipation pathways, while the bonding layers provide both adhesion and mechanical strength. This merging reduces the need for separate components and processes.
Solution Approach 2:
The bonding portions are designed to perform multiple functions simultaneously. The first bonding portions serve as both electrical connections and heat dissipation structures, while also providing mechanical bonding. The second bonding portions provide both structural support and additional bonding strength. This multi-functionality reduces the overall number of components needed.
3Object-affected harmful factors
If conventional bonding methods are used, then the device structure is simple, but heat dissipation is insufficient leading to discoloration and cracks
Solution Approach 1:
The bonding layers and electrodes act as intermediary structures between the phosphor plate and the light emitting chips. These intermediaries facilitate heat transfer from the phosphor plate to the heat sink, preventing heat accumulation that would cause discoloration and cracks. The bonding layers provide thermal pathways while maintaining the mechanical bond between components.
Solution Approach 2:
The thermal and electrical parameters of the bonding structure are optimized to improve heat dissipation. The electrodes are designed with specific conductivity and cross-sectional areas to maximize heat transfer. The bonding layers have controlled thicknesses and material compositions to balance thermal conductivity with mechanical bonding strength, preventing heat-induced damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability and adhesion accuracy of phosphor plates by resisting high temperatures and preventing heat-induced discoloration and cracks, while simplifying the bonding process.
Implementation Method 1
A light emitting device design that includes a phosphor plate bonded to a light emitting structure using multiple bonding portions with distinct electrodes and bonding layers, allowing for eutectic bonding
Implementation Method 2
allowing for eutectic bonding and improved heat dissipation, eliminating the need for a separate pad exposure process and enhancing adhesion accuracy
Data Source
AI summary
Disclosed is a light emitting device including a light emitting structure comprising a first semiconductor layer, an active layer and a second semiconductor layer, a phosphor plate disposed on the second semiconductor layer, a first electrode portion disposed on the phosphor plate, and a plurality of bonding portions disposed between the light emitting structure and the phosphor plate, the bonding portions bonding the phosphor plate to the light emitting structure, wherein each bonding portion includes at least one first bonding portion electrically connected to the first electrode portion.